Global chip making capacity rises, says SEMI
Peter Clarke, EETimes
12/9/2010 7:14 AM EST
LONDON - Fab tool trade group SEMI is predicting an 8 percent annual growth in installed IC manufacturing capacity in 2010 to be followed by at least 8 percent in 2011 and at least 9 percent in 2012. The prediction is based on SEMI's collation of announced capital expenditure plans and other analyses, according to Christian Gregor Dieseldorff responsible for industry research and statistics at SEMI.
To read the full article, click here
Related Semiconductor IP
- NPU IP
- JPEG XL Encoder
- I2C Master/Slave Controller Core
- NVMe Validation Test Suite
- Hybrid Memory Cube Verification IP
Related News
- New IC Manufacturing Lines to Boost Total Industry Wafer Capacity 8%
- Top Five Leaders Continue Expanding Share of Global IC Fab Capacity
- Wafer Capacity Forecast to Climb 8.7% As 10 New Fabs Enter Production
- Localization of Chip Manufacturing Rising. Taiwan to Control 48% of Global Foundry Capacity in 2022, Says TrendForce
Latest News
- GF unveils roadmap to deliver the world’s most advanced FD-SOI platform for Physical AI
- GlobalFoundries marks Dresden expansion milestone, announces next-generation platform for Physical AI
- TSMC September 2026 Revenue Report
- Lattice Collaborates with Arm to Advance Secure, Adaptable AI Data Center Infrastructure
- ZLG Selects CAST CAN XL and TSN IP for Next-Generation Vehicle-Network Development and Test Tools