Real Intent Expands ISO 26262 Functional Safety Compliance for Static Sign-Off Products
2021-05-12 08:14:00
EDA & Design Tools
Semiconductor IP News Archive - Page 329 of 1964
MIPI CSI 3, DSI 2 Tx & Rx Advanced Controller & PHY IP Cores available in major Fabs & Nodes for SOC Designs for Imaging and Display Applications
2021-05-12 01:34:00
IP Cores & Design
Vastai Technologies Closes US$75 Million Series A+ Financing
2021-05-12 01:05:00
Strategic Partnerships
Silex Insight extends their AES-GCM Crypto Engine offering by introducing an ultra-low latency version for PCI Express 5.0 and Compute Express Link 2.0
2021-05-11 14:51:00
IP Cores & Design
Mythic Raises $70 Million in Series C Funding Led by BlackRock and Hewlett Packard Enterprise
2021-05-11 13:35:00
Strategic Partnerships
Dialog Semiconductor Selected as SiFive Preferred Power Management Partner for RISC-V Development Platforms
2021-05-11 13:23:00
Strategic Partnerships
BrainChip Demonstrates Akida Neuromorphic Processor as Part of Data Science Week
2021-05-11 07:56:00
Misc
Synopsys ZeBu Server 4 Adopted by Xsight Labs for Intelligent Networking Switch Processor
2021-05-10 15:08:00
EDA & Design Tools
OpenPOWER Foundation announces LibreBMC, a POWER-based, fully open-source BMC
2021-05-10 14:41:00
Misc
TSMC April 2021 Revenue Report
2021-05-10 13:28:00
Financials
CEVA, Inc. Announces First Quarter 2021 Financial Results
2021-05-10 13:09:00
Financials
CEVA to Acquire Intrinsix Corp, Expanding its Offering to Include Full Turnkey IP Platforms
2021-05-10 13:06:00
Strategic Partnerships
Sondrel's latest reference IP platform enables ultra-powerful signal and data processing SoCs to be created faster for lower costs
2021-05-10 07:33:00
IP Cores & Design
IBM Unveils World's First 2 nm Chip
2021-05-10 07:03:00
Analysis & Insight
NeuReality unveils novel AI-centric platform to empower the growth of real-life AI applications
2021-05-10 01:58:00
SoC Architecture & Assembly
AEDVICES Consulting set up a new organization to boost its growth
2021-05-10 01:00:00
Misc
Arm v9, the Next 10 Years
2021-05-06 14:39:00
Analysis & Insight
CEVA's Bluetooth Dual Mode 5.2 Platform Achieves SIG Qualification, Expedites IC Design for TWS Earbuds and More
2021-05-06 13:03:00
IP Cores & Design
CCSDS 231.0-B-3 LDPC Encoder and Decoder IP Core from Creonic Now Available
2021-05-06 12:22:00
IP Cores & Design
UMC Reports Sales for April 2021
2021-05-06 09:33:00
Financials