Imperas Simulation Reference Models selected by IAR Systems for Arm 64bit
2021-05-26 15:22:00
SoC Architecture & Assembly
Semiconductor IP News Archive - Page 326 of 1964
Synopsys Digital and Custom Design Platforms Certified for TSMC's Latest 3nm Process Technology
2021-05-26 15:18:00
EDA & Design Tools
eYs3D Microelectronics, Co. Raises $7 Million Series A from Leading Industry Strategic Investors for Vision/AI Chips
2021-05-26 14:25:00
Strategic Partnerships
Hardent Joins Samsung SAFE IP Partner Program & Launches New Display IP Subsystem Solution in Collaboration with Rambus
2021-05-26 08:32:00
Misc
Oracle adds Arm Neoverse-based cloud instances with OCI Ampere A1
2021-05-26 07:36:00
Commercial Deals
proteanTecs' UCT to be Exhibited at the TSMC 2021 Online Technology Symposiums for North America, Europe and Taiwan
2021-05-26 06:42:00
Misc
Siemens expands Simcenter with AI-driven generative engineering for systems architectures
2021-05-26 04:14:00
EDA & Design Tools
Lattice sensAI Solution Stack Simplifies Deployment of AI/ML Models on Smart Edge Devices
2021-05-26 03:11:00
SoC Architecture & Assembly
Cadence Collaboration with Arm Enables Customers to Successfully Tape out Next-Generation Arm Mobile Designs
2021-05-26 02:25:00
EDA & Design Tools
Global 200mm Fab Capacity on Pace to Record Growth to Meet Surging Demand and Address Chip Shortage, SEMI Reports
2021-05-25 16:17:00
Analysis & Insight
Synopsys Enables First-Pass Silicon Success for Early Adopters of Next-Generation Armv9 Architecture-based SoCs
2021-05-25 16:10:00
EDA & Design Tools
Top-15 Semi Companies Log Year-Over-Year Growth of 21% in 1Q21
2021-05-25 16:05:00
Analysis & Insight
Arm Total Compute solutions bring performance, security and Armv9 to the broadest range of Client devices
2021-05-25 15:20:00
IP Cores & Design
PLDA Announces XpressRICH PCI Express 6.0 Controller IP for Next Generation SoC Designs
2021-05-25 13:33:00
IP Cores & Design
Avery Design Launches PCI Express 6.0 Verification IP to Enable Early Development, Compliance Checking for New Version of Standard
2021-05-25 13:22:00
Verification IP
U.S. Chip Makers Embrace Collaboration
2021-05-24 15:16:00
Analysis & Insight
Logic Fruit Technologies Launches ARINC 818 RTL IP Core for Avionics applications
2021-05-24 12:18:00
IP Cores & Design
RISC-V Functional Safety Processor IP Core Introduced by CAST and Fraunhofer IPMS
2021-05-24 12:00:00
IP Cores & Design
GUC Announces GLink-3D Die-on-Die Interface IP using TSMC N5 and N6 Process for 3DFabric Advanced Packaging Technology
2021-05-24 11:51:00
IP Cores & Design
Arm partners are shipping more than 900 Arm-based chips per second based on latest results
2021-05-24 08:59:00
Commercial Deals