Palma Ceia SemiDesign Announces New Wi-Fi HaLow Chips, PCS2100 and PCS2500 - Ideal for Industry 4.0 2021-06-07 12:27:00 SoC Architecture & Assembly
Synopsys Expands Multi-Die Solution Leadership with Industry's Lowest Latency Die-to-Die Controller IP 2021-06-03 15:13:00 IP Cores & Design
intoPIX delivers JPEG XS Compressed Solutions for Low Latency Video Streaming with NVIDIA GPUs 2021-06-03 10:57:00 SoC Architecture & Assembly
Sondrel launches the fourth IP platform - SFA 350A - that delivers faster time to market for ADAS ASICs 2021-06-03 09:39:00 IP Cores & Design
Brite Semiconductor Releases ONFI 4.2 IO and Physical Layer IP based on SMIC 14nm FinFET Process 2021-06-03 09:28:00 IP Cores & Design
SmartDV Announces Support for ARINC Standards with Design and Verification IP 2021-06-03 07:18:00 IP Cores & Design
Siemens enhances Nucleus ReadyStart for Arm platforms with enhanced debug, security and stability features 2021-06-03 06:09:00 SoC Architecture & Assembly
EdgeCortix Collaborates with Cadence to Accelerate AI Chip Design 2021-06-03 01:14:00 EDA & Design Tools
Arm empowers MCU software developers to capitalize on IoT potential 2021-06-02 15:39:00 SoC Architecture & Assembly
PLDA and AnalogX Announce Market-leading CXL 2.0 Solution featuring Ultra-low Latency and Power 2021-06-02 13:26:00 IP Cores & Design
NXP Ramps Automotive Processing Innovation with Two Processors on TSMC 16nm FinFET Technology 2021-06-02 13:22:00 Foundries & Process Nodes
PUFsecurity and Andes Technology Cooperate to Integrate Crypto Coprocessor PUFiot into RISC-V AIoT Security Platform 2021-06-02 09:27:00 IP Cores & Design
TSMC Unveils Innovations at 2021 Online Technology Symposium 2021-06-02 07:38:00 Foundries & Process Nodes
Aldec Launches HES-DVM Proto "Cloud Edition" - Giving Engineers Easier Access to FPGA-based ASIC & SoC Prototyping 2021-06-02 06:53:00 EDA & Design Tools
First step in its Multi-Codec HEVC and VVC Platform Initiative 2021-06-02 05:58:00 Legal & IP Strategy
Synopsys DesignWare IP Achieves Broad Industry Adoption with Multiple First-Pass Customer Silicon Successes on TSMC's N5 Process 2021-06-01 15:11:00 Commercial Deals