CHIPS Alliance launches the SV Tools Project for open source development of SystemVerilog/UVM codebases
2026-03-31 06:52:00
EDA & Design Tools
Semiconductor IP News Archive - Page 21 of 1964
Socionext Collaborates with Arm to Advance AI Data Center Infrastructure with Arm Total Design
2026-03-31 06:07:07
Strategic Partnerships
EDGEAI to Revolutionize Smart Metering with BrainChip Akida 2 License
2026-03-30 13:47:00
Commercial Deals
IC Manage Advances GDP-XL to GDP-AI — Boosting Designer Efficiency and Accelerating Workflows
2026-03-30 07:35:26
EDA & Design Tools
Safe and Secure Technologies, the new BSC and UPC spin-off that will design chips for critical sectors where “failure is not an option”
2026-03-27 12:21:00
Funding & Investments
CHERI-Mocha memory-safe compute subsystem is now open
2026-03-27 06:36:01
IP Cores & Design
GlobalFoundries Files Patent Infringement Lawsuits Against Tower Semiconductor to Protect High-Performance American Chip Innovation
2026-03-26 16:21:00
Foundries & Process Nodes
Weebit Nano announces A$80.0 million Placement
2026-03-26 12:36:00
Funding & Investments
Joya Design Takes Neuromorphic Chip from Design to Device with First Innatera-Powered Consumer Audio Product at AWE China
2026-03-25 12:26:01
SoC Architecture & Assembly
Arm expands compute platform to silicon products in historic company first
2026-03-24 19:24:00
SoC Architecture & Assembly
Synopsys Supports New Arm AGI CPU with Full-Stack Design Solutions
2026-03-24 18:51:00
Commercial Deals
Altera and Arm Collaborate to Deliver Efficient, Programmable Solutions for AI Data Centers
2026-03-24 18:12:00
Commercial Deals
JEDEC® Releases Updated LPDDR5/5X SPD Standard with Enhanced Mode‑Switching Support
2026-03-24 16:17:00
Standards & Interconnects
Arteris Network-on-Chip IP Deployed in Renesas’ Next-Gen R-Car Automotive Technology
2026-03-24 13:11:00
Commercial Deals
Quintauris and Ashling Join Forces to Strengthen the RISC-V Software Ecosystem
2026-03-24 12:40:00
Ecosystem Landscape
CAST Introduces PDM-to-PCM IP Core for Easy Interfacing of Digital Microphones with SoCs
2026-03-24 08:16:16
IP Cores & Design
Faraday Highlights 40nm SONOS eNVM as NOR Flash Alternative for MCU Designs
2026-03-24 06:47:47
IP Cores & Design
Kandou AI Secures Strategic Funding to Redefine AI Connectivity and Break Memory Bottlenecks in AI
2026-03-23 14:31:51
Funding & Investments
CEA-Leti and Fraunhofer IPMS Validate Wafer Exchange for Ferroelectric Memory Materials Within the FAMES Pilot Line
2026-03-23 13:15:00
Manufacturing & Yield
How GlobalFoundries Takes AI from Pilot to Global Scale
2026-03-23 12:48:00
Analysis & Insight