Semiconductor Industry Damage Assessment (Disaster in Japan)
March 21, 2011
The earthquake and subsequent tsunami that devastated Japan on March 11th, 2011 will have far reaching ramifications around the world for years to come. People have asked me how this disaster will affect the semiconductor industry so I will try and summarize it in this blog.
To read the full article, click here
Related Semiconductor IP
- SMC 2nm 1V8 ESD Power Clamp – Low Leakage
- TSMC 2nm 1V8 ESD Local Clamp – Low Leakage
- Zigbee Transceiver PHY
- Data Flow Architecture IP
- AMBA SPI Controller MRAM Controller
Related Blogs
- Semiconductor Industry 2008 - 2018
- TSMC Earthquake Damage Redo
- Semiconductor Industry 2025
- Keynote: Charting the AI-Powered Transformation in the Semiconductor Industry
Latest Blogs
- IDS-NoC: A Scalable Interconnect Solution for Modern SoC Design
- Leading-edge AI IC designs demand comprehensive HAV methodologies
- Beyond the Fab: Building Europe’s Next Generation of Semiconductor Champions
- AI Semiconductor Design at 3nm and 2nm: Silicon-Proven IP
- Samsung Foundry and Cadence Expand Infrastructure and Physical AI Solution