Optimized on-chip ESD protection to enable high-speed Ethernet speed in cars
A recent supply shortage in the semiconductor industry led to temporary closures of car fabrication facilities globally. This clearly shows the increased integration of semiconductors in cars. Since the end of the 60-ies, car makers have used electronics for a growing set of functions. Today, about 10% of the total semiconductor market is related to automotive applications. Electronics are used for diverse reasons including entertainment, engine control, dashboard interaction, safety, preventive maintenance, advanced driver-assistance systems (ADAS),…
Automotive ethernet
In the past most Electronic Control Units (ECU) used CAN and LIN interfaces to connect to sensors, actuators and each other. While LIN and CAN interface will remain the most used interfaces, more recent applications need (much) faster communication options.
Car makers also need a way to add more electronics without increasing the weight and cost. A standardized, flexible and cost-effective, high-speed communication concept is required.
Automotive ethernet is therefore pushed by many in the industry as the perfect solution.
To read the full article, click here
Related Semiconductor IP
- 6.5V ESD Clamp in 180nm Technology
- ESD diode and Clamps for 90nm TSMC G/GT/LP
- Stand alone ESD diode for TSMC .13u Foundry Process
- ESD Protection
- High-voltage solutions in baseline GlobalFoundries and multi-foundry technologies
Related Blogs
- Selecting optimized ESD protection for CMOS image sensors
- Breakthrough in area efficiency of on-chip ESD protection
- Ultra Ethernet Consortium Set to Enable Scaling of Networking Interconnects for AI and HPC
- Rivos and Canonical partner to deliver scalable RISC-V solutions in Data Centers and enable an enterprise-grade Ubuntu experience across Rivos platforms
Latest Blogs
- IDS-NoC: A Scalable Interconnect Solution for Modern SoC Design
- Leading-edge AI IC designs demand comprehensive HAV methodologies
- Beyond the Fab: Building Europe’s Next Generation of Semiconductor Champions
- AI Semiconductor Design at 3nm and 2nm: Silicon-Proven IP
- Samsung Foundry and Cadence Expand Infrastructure and Physical AI Solution