Vendor: Certus Semiconductor Category: ESD Protection

6.5V ESD Clamp in 180nm Technology

Standalone 6.5V ESD Power Clamp in 180nm technology for use in wirebond or flipchip.

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Overview

Standalone 6.5V ESD Power Clamp in 180nm technology for use in wirebond or flipchip.

Key features

  • 1.8V/5V FETs
  • 1P6M with 2fF MiMs
  • Temperature: -40C to 125C
  • Metallization for cell is M1-M5
  • ESD targets of >2kV HBM JEDEC, 500V CDM
  • Lath-up Immunity
  • Cell Size: 60um x 80um (no fixed orientation)

What’s Included?

  • Verilog Models for ESD
  • LEFs
  • CDL netlists for DRC and LVS
  • GDS Layouts
  • Spectre scs models for simulation

Specifications

Identity

Part Number
180nm 6.5V ESD Power Clamp
Vendor
Certus Semiconductor
Type
Silicon IP

Provider

Certus Semiconductor
HQ: United States
Contact Certus Semiconductor

Learn more about ESD Protection IP core

One Platform, Five Libraries: Certus Semiconductor’s I/O IP Portfolio for Every Application on TSMC 22nm ULL/ULP Technologies

Certus Semiconductor’s I/O libraries for TSMC’s 22nm ultra-low leakage (22ULL) and 22nm ultra-low power (22ULP) technologies offer robust, high-performance solutions tailored to a wide range of SoC designs — from ultra-low power IoT nodes to demanding consumer and automotive systems. Whether you need low leakage, high drive strength, or analog compatibility, our production-proven IP covers it all.

Frequently asked questions about ESD Protection Library IP cores

What is 6.5V ESD Clamp in 180nm Technology?

6.5V ESD Clamp in 180nm Technology is a ESD Protection IP core from Certus Semiconductor listed on Semi IP Hub.

How should engineers evaluate this ESD Protection?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this ESD Protection IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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