Intel is NOT Transparent Again!
Recent headlines suggest that Intel was not transparent about some of the products they showed at the CES keynote. Intel confirmed on Friday that they used ARM-based chips for some of the products but would not say which ones. When your company’s tag line is “Intel Inside” and you hold up a product during your keynote wouldn't one assume that Intel was actually inside?
Today saying someone is not transparent really means they are being deceptive and when that someone is the CEO of a publicly traded semiconductor company it is serious business, my opinion. Even more glaring is the Intel claim of a 35% density advantage over TSMC at 14nm. This was presented during the November 21st 2013 Intel analyst meeting.
To read the full article, click here
Related Semiconductor IP
- TSMC 7nm 0V75 / 0V9 ESD Local Clamp – Low Cap
- TSMC 65nm 3V3 ESD Local Clamp – Rad Hard
- TSMC 5nm 1V8, 1.2V and 0.9V ESD Local Protection – Low Cap
- TSMC 3nm 3V3 ESD Local Clamp
- TSMC 3nm 1V2 ESD Local Clamp – Low Capacitance
Related Blogs
- Why Intel 14nm is NOT a Game Changer!
- Demler: Quad Core is Just For Marketing; Intel Will Not Succeed in Mobile
- Intel is NOT Quitting Mobile!
- Intel apologises (again)
Latest Blogs
- Beyond Trusted: What the NSA’s New Guidance Means for Hardware Security
- A scalable, shader-programmable vector graphics GPU core for low-power MCUs
- Navigating ISO 26262 Part 11: A Guide for Semiconductor Architects
- Embedded Security explained: Digital signatures
- Hardware security verification must go beyond functional testing