Generative AI is changing the world - but can it continue to succeed with our current data infrastructure?
CEO and co-founder, Tony Pialis, recently shared his thoughts with Data Center Dynamics on the subject. Tony says that for generative AI technologies to thrive, the industry must invest in bringing a customized approach to high-speed connectivity – namely through chiplets and custom silicon solutions – before it is too late.
Read more of what Tony thinks about how our data infrastructure needs to change to allow generative AI to thrive here!
To read the full article, click here
Related Semiconductor IP
- TSMC 7nm 0V75 / 0V9 ESD Local Clamp – Low Cap
- TSMC 65nm 3V3 ESD Local Clamp – Rad Hard
- TSMC 5nm 1V8, 1.2V and 0.9V ESD Local Protection – Low Cap
- TSMC 3nm 3V3 ESD Local Clamp
- TSMC 3nm 1V2 ESD Local Clamp – Low Capacitance
Related Blogs
- Enabling the Next Generation of AI Infrastructure with Ethernet for Scale-Up Networking (ESUN)
- The Missing Layer in AI Systems Design is Predictable, Scalable Data Movement
- What is the EDA problem worth solving with AI?
- Using SystemC TLM Modeling To Solve AI Data Movement Challenges
Latest Blogs
- Beyond Trusted: What the NSA’s New Guidance Means for Hardware Security
- A scalable, shader-programmable vector graphics GPU core for low-power MCUs
- Navigating ISO 26262 Part 11: A Guide for Semiconductor Architects
- Embedded Security explained: Digital signatures
- Hardware security verification must go beyond functional testing