Minimize Design Risk and Achieve First-Pass Silicon Success on TSMC's N3E Process
Although the path from chip design to tape-out was never an easy one to navigate, this journey has become ever more challenging due to a growing demand for lower-power, higher-bandwidth applications. Indeed, chip architectures continue to increase in complexity on the most advanced FinFET nodes as billions of transistors are packed into smaller, denser silicon packages to meet new power, performance, and area (PPA) requirements. That’s why Synopsys and TSMC continuously collaborate to deliver the chip design industry’s broadest silicon-proven IP portfolio on the latest process technologies.
Synopsys’ IP silicon success for the TSMC N3E node—which provides a fast path to TSMC N3P, N3AE, and beyond—minimizes integration risks and accelerates time to market. Read on to learn how Synopsys IP enables semiconductor companies to develop advanced SoCs and multi-die systems for a wide range applications and technologies including artificial intelligence (AI) and machine learning (ML), high-performance computing (HPC), and mobile.
To read the full article, click here
Related Semiconductor IP
- Zigbee Transceiver PHY
- Data Flow Architecture IP
- AMBA SPI Controller MRAM Controller
- Ethernet MAC
- Protocol Bridges
Related Blogs
- Synopsys Accelerates Multi-Die System Designs With Successful UCIe PHY IP Tape-Out on TSMC N3E Process
- Cadence Silicon Success of UCIe IP on Samsung Foundry’s 5nm Automotive Process
- Synopsys Tapes Out SLM PVT Monitor IP on TSMC N5 and N3E Processes
- Cadence Achieves Successful Silicon Validation of 1st IP Test Chips on Intel 18A
Latest Blogs
- IDS-NoC: A Scalable Interconnect Solution for Modern SoC Design
- Leading-edge AI IC designs demand comprehensive HAV methodologies
- Beyond the Fab: Building Europe’s Next Generation of Semiconductor Champions
- AI Semiconductor Design at 3nm and 2nm: Silicon-Proven IP
- Samsung Foundry and Cadence Expand Infrastructure and Physical AI Solution