<4Gbps Low Power D2D Interface in TSMC 16nm & 28nm
A
- TSMC
- 28nm
Semiconductor IP cores (Intellectual Property cores) are reusable design blocks used in SoC and ASIC development to accelerate time-to-market and reduce design complexity.
These IP cores span a broad range of technologies, including Analog & Mixed Signal, Compute Acceleration, Graphics & Vision, Interface Connectivity , Memory Interfaces, Security, Wireless, System Peripheral, Embedded Memories, and Foundation Libraries. The catalog covers everything from analog front-ends, data converters, processors, DSPs, AI accelerators, and imaging solutions to high-speed connectivity, memory controllers and PHYs, cryptographic engines, embedded memory macros, standard cell libraries, and wireless communication IP.
This catalog allows you to explore and compare IP cores from leading vendors, based on performance, power, process node compatibility, and application domain.
Whether you are designing for automotive, wireless communication, consumer electronics, or data centers, you can find the right IP solutions for your system requirements.
<4Gbps Low Power D2D Interface in TSMC 16nm & 28nm
A
Custom die-to-die interface in 12/16nm process technology.
Video Processing Unit (VPU) IP
High Number of Streams Decoder For Data Center
Hantro VC9800E enables up to 256 streams encoding with high video quality single-core solution, or multi-core solution, supportin…
AI processing engine - Voice control, Context detection and Sensor applications
AON1020™ belongs to the optimized AONSens™ Neural Network cores for Voice and Audio recognition as well as other sensor applicati…
AI processing engine - Voice control, Context detection and Speaker ID
AON1010™ belongs to the optimized AONVoice™ Neural Network cores for Voice and Audio recognition.
112G LRM PHY, TSMC N5 x2, North/South (vertical) poly orientation
The Multi-Protocol 112G PHY IP is part of a high performance multi-rate transceiver portfolio for high-end networking and high pe…
32-bit RISC-V microcontroller.
64-bit RISC-V embedded core with in-order single issue pipeline
64-bit RISC-V embedded core with in-order single issue pipeline.
32-bit RISC-V embedded core with in-order single issue pipeline
32-bit RISC-V embedded core with in-order single issue pipeline.
Low Power D2D Interface in TSMC 16nm FFC/FFC+
A 600MBps Low Power Die-to-Die Interface in TSMC 16nm FFC/FFC+.
RF ESD library in TSMC 55nm LP
RF ESD cells in TSMC 55nm LP targetting low-capacitance ESD protection.
6.5V ESD Clamp in 180nm Technology
Standalone 6.5V ESD Power Clamp in 180nm technology for use in wirebond or flipchip.
Unlike fixed unidirectional die-to-die solutions, NuLink technology is able to deliver low-power and high-performance D2M solutio…
The NuLink technology delivers low-power and high-performance D2D IP core products, which support multiple industry standards and…
5V ESD Clamp in GlobalFoundries 180nm LPe
A GlobalFoundries 180nm LPe Specialized 5V ESD Clamp.
The XSR PHY IP for 112Gbps per lane die-to-die connectivity enables high-bandwidth ultra and extra short reach interfaces in mult…
The Bitec Camera Front End IP allows developers to interface CMOS and CCD cameras to an Altera FPGA.
The Bitec HDMI 2.1b IP Core enables HDMI interconnectivity in FPGA or ASIC devices.
Column-parallel high resolution, high speed ADC
Massar is a column-parallel high resolution, high speed ADC tailored to low power consumption and large frame imaging sensors.