Vendor:
Eliyan
Category:
Custom
Die-to-Memory (D2M) PHY
Unlike fixed unidirectional die-to-die solutions, NuLink technology is able to deliver low-power and high-performance D2M solutio…
Overview
Unlike fixed unidirectional die-to-die solutions, NuLink technology is able to deliver low-power and high-performance D2M solutions.
Block Diagram
UMI block diagram
Applications
- Chiplets connected on standard organic packages without large silicon interposers or silicon bridges but with interposer-like bandwidth/power/latency.
- SiP applications that benefit from up to at least four times the substrate area compared to the largest silicon interposer and thus a far higher number of chiplets in the package, resulting in major performance and power advantages.
- ASIC designs where a Network on Chip is split across two or more chiplets.
- Applications that benefit from placement flexibility to mix and match chiplets of different dimensions.
- Chiplet applications–such as HBM—where there must be physical separation between a hot ASIC and heat-sensitive dies.
Specifications
Identity
Part Number
UMI
Vendor
Eliyan
Type
Silicon IP
Files
Note: some files may require an NDA depending on provider policy.
Provider
HQ:
USA
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Frequently asked questions about Custom Die-to-Die IP cores
What is Die-to-Memory (D2M) PHY?
Die-to-Memory (D2M) PHY is a Custom IP core from Eliyan listed on Semi IP Hub.
How should engineers evaluate this Custom?
Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Custom IP.
Can this semiconductor IP be compared with similar products?
Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.