High-scalable, high-performance Interconnect fabric IP with cache coherence support
StarNoC-700 is the vendor's self-developed high-scalable, high-performance interconnect fabric IP supporting cache coherence, ena…
- Coherency
High-scalable, high-performance Interconnect fabric IP with cache coherence support
StarNoC-700 is the vendor's self-developed high-scalable, high-performance interconnect fabric IP supporting cache coherence, ena…
Interconnect fabric IP with cache coherence support
StarNoC-500 is the vendor's first self-developed interconnect fabric IP with cache coherence support, supporting the construction…
High Bandwidth Memory 3 (HBM3/3E) IP optimized for Samsung SF4X
The HBM3 IP consists of a PHY and memory controller optimized for Samsung SF4X process to support the HBM3 memory standard (JESD2…
HBM2E and HBM2 are high-performance memory IPs that offer a combination of high memory bandwidth, low power consumption, low late…
Lightweight die-to-die interconnect solution consisting of the Physical Layer, Die-to-Die Layer and Protocol Layer optimized for …
SFA 300 is designed to implement scalable processing applications supporting local networking.
Physically aware network-on-chip IP designed to speed development.
A2B is a high performance System-on-Chip interconnect designed for use in synthesizable designs.
Ncore Cache Coherent Interconnect IP
High-bandwidth, low-latency network-on-chip (NoC) interconnect for rapid modular innovation.
The CXL Controller IP is micro-architected with power, performance, and area optimization for high bandwidth, minimum latency, an…
The AMBA5 CHI Verification IP provides an effective & efficient way to verify the components interfacing with AMBA 5 CHI bus of a…
Produced by DRAM manufacturers such as Samsung and Micron, High Bandwidth Memory or HBM, provides users with high bandwidth, low …
Neoverse Compute Subsystems N3 (CSS N3)
The Performance-per-Watt Arm Neoverse N3 Platform Validated by Arm for Networking and Edge Markets configurable to target 5G, DPU…
Neoverse Compute Subsystems V3 (CSS V3)
The High-Performance Arm V3 Platform Performance-Optimized and Validated by Arm Arm Neoverse CSS V3 is the fastest path to buildi…
USB is the ubiquitous interconnect standard of choice for a wide range of computing and consumer applications.
Future-proof IP for training and inference with leading performance per watt and per dollar
Tenstorrent develops AI IP with precision, anchored in RISC-V’s open architecture, delivering specialized, silicon-proven solutio…
LPDDR5X/5/4X/4 combo PHY at 12nm
The LPDDR5X/5/4X/4 combo PHY IP features a state-of-art mixed-signal architecture that addresses the challenges of DRAM integrati…
The LPDDR5X/5/4X/4 combo PHY IP features a state-of-art mixed-signal architecture that addresses the challenges of DRAM integrati…
The Tessent Embedded Software Development Kit (ESDK) is a set of software libraries designed to be compiled and run on an embedde…
Vtool APB2AXI bridge connects slow (APB) and fast (AXI) NoC parts.