T2M GmbH IP Cores

Bridge to APB, AHB, and AXI bus SHA2-384 is a universal solution that effectively speeds up the SHA2-384 hash function that compl…

• SHA2 (SHA-384)

AES bridge, a cryptographic coprocessor that complies with FIPS 197 Encryption Standard, employs the Rijndael encryption method t…

• Symmetric Crypto
• In Production
• Immediately

Our ECC IP Core is a solution that gives your systems access to the capabilities of elliptic curve encryption.

• ECC

This eDisplayPort 1.4 Tx Controller IP Core integrates into any SoC or FPGA development, supporting the eDisplayPort 1.4b specifi…

• Displayport
• In Production
• Immediately

This eDisplayPort 1.4 Rx Controller IP Core is a versatile and comprehensive solution designed for easy integration into any SoC …

• Displayport
• In Production
• Immediately

The GPHY is a fully integrated IP Core with low power consumption for Giga 10/100/1000 Ethernet applications.

• Samsung
• 8nm
• 8LPP
• In Production

Process voltage and temperature detection of the silicon chip die is accomplished by PVT Sensor, an IP.

• PVT Monitor
• In Production
• Immediately

DDR3 interface provides full support for the DDR3 interface, compatible with JESD79-3F specification and DFI-version 2.0 or highe…

• Controller
• DDR3

DDR2 interface provides full support for the DDR2 interface, compatible with JESD79-2F specification and DFI-version 2.0 or highe…

• Controller
• DDR2

DDR interface provides full support for the DDR interface, compatible with JESD79F specification and DFI-version 2.0 or higher Sp…

• Controller

The entire physical layer (PHY) IP solution for USB 2.0 was created to provide exceptional performance and consume little power.

• USB 2.0
• TSMC
• 16nm
• FFC
• In Production

The most recent MIPI Feature Storage IP Solution SerDes PHY Product Brief Alliance M-PHY v4.1 Specification, UniPro v1.8 Specific…

• MIPI M-PHY
• TSMC
• 55nm
• ULP
• In Production

The MIPI M-PHY Gear 4 IP is compatible with the most recent MIPI Feature Storage IP Solution SerDes PHY Product Brief Alliance M-…

• MIPI M-PHY
• TSMC
• 40nm
• LP
• In Production

Many production nodes use the C-PHY/D-PHY Combo because it uses the fewest resources and energy.

• MIPI D-PHY
• TSMC
• 40nm
• LP
• In Production

C-PHY/D-PHY Combo in various production nodes at low cost and power.

• MIPI D-PHY
• TSMC
• 40nm
• LP
• In Production

Several production nodes employ C-PHY/D-PHY Combo to consume the least amount of energy and funds.

• MIPI D-PHY
• TSMC
• 28nm
• HPC+
• In Production

C-PHY/D-PHY Combo at low cost and power in several manufacturing nodes.

• MIPI D-PHY
• TSMC
• 28nm
• HPC+
• In Production

In order to use the least amount of power and money, several production nodes use C-PHY/D-PHY Combo.

• MIPI D-PHY
• TSMC
• 22nm
• ULP
• In Production

C-PHY/D-PHY Combo in numerous process nodes at low cost and power.

• MIPI D-PHY
• TSMC
• 22nm
• ULP
• In Production

In order to use the least amount of power and money, several production nodes use C-PHY/D-PHY Combo.

• MIPI D-PHY
• TSMC
• 16nm
• FFC
• In Production