The Platform Based SOC Design that Utilizes Structured ASIC Technology
The Platform Based SOC Design that Utilizes Structured ASIC Technology
Vendor:
Faraday Technology
Category:
High-Speed
Specialty SSTL IO IP, BOAC (Bonding Over Active Circuit), UMC 0.13um HS/FSG process
UMC 0.13um HS/FSG Logic Library (core) 1.8V MDDR IO with POC (Pad On Circuit).
Overview
UMC 0.13um HS/FSG Logic Library (core) 1.8V MDDR IO with POC (Pad On Circuit).
Silicon Options
| Foundry | Node | Process | Maturity |
|---|---|---|---|
| UMC | 130nm | HS | — |
Specifications
Identity
Part Number
FOC0H_O33_T18_MDDR_IO
Vendor
Faraday Technology
Type
Silicon IP
Provider
HQ:
Taiwan
Learn more about High-Speed IP core
Frequently asked questions about High-Speed I/O Pad IP
What is Specialty SSTL IO IP, BOAC (Bonding Over Active Circuit), UMC 0.13um HS/FSG process?
Specialty SSTL IO IP, BOAC (Bonding Over Active Circuit), UMC 0.13um HS/FSG process is a High-Speed IP core from Faraday Technology listed on Semi IP Hub. It is listed with support for umc.
How should engineers evaluate this High-Speed?
Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this High-Speed IP.
Can this semiconductor IP be compared with similar products?
Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.