Vendor: Synopsys, Inc. Category: High-Speed

TSMC N3P 1.2V IO Platform supporting cells with Additional Features

TSMC N3P 1.2V IO Platform supporting cells with Additional Features

Silicon Options

Foundry Node Process Maturity
TSMC 3nm N3P —

Specifications

Identity

Part Number
dwc_io_ts3p_cf_1p2v_basekit
Vendor
Synopsys, Inc.
Type
Silicon IP

Files

Note: some files may require an NDA depending on provider policy.

Provider

Learn more about High-Speed IP core

Synopsys Advances Virtual Development of Next-Generation Automotive and Physical AI Applications with Infineon AURIX™ RC1 Microcontroller Family

Synopsys extended its long-standing collaboration with Infineon to deliver a Synopsys Virtualizer™ Development Kit (VDK) supporting Infineon’s AURIX™ RC1 microcontroller (MCU) family. The VDK equips automotive engineering teams with a virtual prototype of the AURIX™ RC1 MCU, Infineon’s new scalable computing platform for software-defined vehicle (SDV) and Physical AI applications.

Frequently asked questions about High-Speed I/O Pad IP

What is TSMC N3P 1.2V IO Platform supporting cells with Additional Features?

TSMC N3P 1.2V IO Platform supporting cells with Additional Features is a High-Speed IP core from Synopsys, Inc. listed on Semi IP Hub. It is listed with support for tsmc.

How should engineers evaluate this High-Speed?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this High-Speed IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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