DDR3 Combo PHY Data Block for solder bump application; UMC 40nm LP/RVT Logic Process
DDR3 Combo PHY Data Block for solder bump application; UMC 40nm LP/RVT Logic Process
- Controller + PHY + 1
- DDR3
- UMC
- 40nm
- LP
DDR Interface IP cores provide the controller, PHY, and calibration technologies required to connect SoCs and ASICs to external DRAM memory devices, enabling high-bandwidth and low-latency memory access for compute-intensive applications.
This category includes IP solutions supporting DDR2, DDR3, DDR4, and DDR5 memory standards. Available implementations may include memory controllers, PHYs, controller-PHY subsystems, training engines, initialization logic, timing management, ECC support, and signal integrity optimization features designed for reliable operation across advanced semiconductor process nodes.
DDR3 Combo PHY Data Block for solder bump application; UMC 40nm LP/RVT Logic Process
DDR3 Combo PHY Data Block for solder bump application; UMC 40nm LP/RVT Logic Process
UMC 55NM SP-RVT with 2.5V device process 16BIT DDR23 COMBO DATA PHY for two layer PCB board usage
UMC 55NM SP-RVT with 2.5V device process 16BIT DDR23 COMBO DATA PHY for two layer PCB board usage
DDR3 Combo PHY Compensation Block for solder bump application; UMC 40nm LP/RVT Logic Process
DDR3 Combo PHY Compensation Block for solder bump application; UMC 40nm LP/RVT Logic Process
DDR3 Combo PHY COMM/ADDR Block for 2-rank and solder bump application; UMC 40nm LP/RVT Logic Process
DDR3 Combo PHY COMM/ADDR Block for 2-rank and solder bump application; UMC 40nm LP/RVT Logic Process
DDR3 Combo PHY COMM/ADDR Block for 2-rank and solder bump application; UMC 40nm LP/RVT Logic Process
DDR3 Combo PHY COMM/ADDR Block for 2-rank and solder bump application; UMC 40nm LP/RVT Logic Process
UMC 55NM SP-RVT with 2.5V device DDR23 COMBO PHY CMD/ADDR Block for 2 layer PCB board usage
UMC 55NM SP-RVT with 2.5V device DDR23 COMBO PHY CMD/ADDR Block for 2 layer PCB board usage
1:2 DDR2/DDR1/MDDR combo PHY; UMC 0.11um HS/Cu Logic Process
1:2 DDR2/DDR1/MDDR combo PHY; UMC 0.11um HS/Cu Logic Process
DDRII Data Block for Chip Application; UMC 0.11um HS/AE (AL Advance Enhancement) Logic Process
DDRII Data Block for Chip Application; UMC 0.11um HS/AE (AL Advance Enhancement) Logic Process
1:2 DDR2/DDR1/MDDR combo PHY; UMC 0.11um HS/Cu Logic Process
1:2 DDR2/DDR1/MDDR combo PHY; UMC 0.11um HS/Cu Logic Process
DDR1/MDDR PHY Data block ; UMC 55nm SP/RVT with 2.5V device LowK Logic Process
DDR1/MDDR PHY Data block ; UMC 55nm SP/RVT with 2.5V device LowK Logic Process
DDR1/MDDR PHY CMD/ADDR BLOCK ; UMC 55nm SP/RVT with 2.5V device LowK Logic Process
DDR1/MDDR PHY CMD/ADDR BLOCK ; UMC 55nm SP/RVT with 2.5V device LowK Logic Process
DDR3/DDR2/LPDDR2 COMBO Interface
IP
DDR3 SDRAM Controller
DDR2 SDRAM Controller
AMBA AHB Bus to SDRAM Controller
AMBA AHB Bus to SDRAM Controller
Pipeline SDRAM Controller
Embedded synchronous single port SRAM/ROM memory controller with AXI slave port.
Embedded synchronous single port SRAM/ROM memory controller with AXI slave port.
DDR3 RTL PHY data module
DDR3 RTL PHY Address Command module
DDR3 RTL PHY Address Command module
Nand Flash Controller with AHB Interface over 74-Bit ECC correction capacity.