Chiplets Semiconductor IP News & Insights

The Future of Silicon Innovation in the Chiplet Era

The Future of Semi Innovation from Disruptive Memory to Chiplets with Alphawave Semi

TechArena host Allyson Klein chats with Alphawave Semi’s Letizia Guiliano about the future of semiconductor innovation across memory, optical and...

Blue Ocean Smart System Unveils Chiplet-Based Products Powered by VeriSilicon's High-Performance Processors

VeriSilicon today announced Blue Ocean Smart System, an AI chiplet and SoC design company, has deployed high-performance AI chips with scalable...

China forms its own chiplet standard amid isolation

The China Chiplet Industry Alliance has released the ‘Chiplet Interconnection Interface Standard’ known as ACC1.0, according to the Financial Association...

Chiplet Summit: Challenges of Chiplet-Based Designs

Chiplet Pioneer Eliyan Joins UCIe and JEDEC Industry Standardization Organizations, Expands Veteran Leadership Team to Accelerate Adoption of Breakthrough Die-to-Die Interconnect Solution

Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today...

Avery Design Systems and CoMira Announce Partnership To Enable UCIe-Compliant Chiplet Design

Avery Design Systems, a leader in functional verification solutions, and high-speed connectivity IP innovator CoMira Solutions today announced a...

UCIe: Enabling the Chiplet-Based Ecosystem

By JHarshit

Chipletz selects Siemens' EDA solutions for its Smart Substrate IC packaging technology

Siemens Digital Industries Software today announced that Chipletz, an innovative fabless substrate startup, has selected Siemens as its strategic...

€270m for RISC-V chiplets to build European exascale supercomputers

EuroHPC is to issue call next month for RISC-V chiplet projects in January with €270m of backing.

Eliyan eliminates silicon interposer to advance D2D chiplet connect for HPC

Eliyan’s chiplet interconnect technology enables connection of homogeneous & heterogenous architectures on a standard organic chip substrate.

Eliyan Closes $40M Series A Funding Round and Unveils Industry's Highest Performance Chiplet Interconnect Technologies

Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today...