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The Fraunhofer institute provides system concepts, design services and fast prototyping in most advanced packaging technologies and will make use...
TechArena host Allyson Klein chats with Alphawave Semi’s Letizia Guiliano about the future of semiconductor innovation across memory, optical and...
VeriSilicon today announced Blue Ocean Smart System, an AI chiplet and SoC design company, has deployed high-performance AI chips with scalable...
The China Chiplet Industry Alliance has released the ‘Chiplet Interconnection Interface Standard’ known as ACC1.0, according to the Financial Association...
Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today...
Avery Design Systems, a leader in functional verification solutions, and high-speed connectivity IP innovator CoMira Solutions today announced a...
By JHarshit
Siemens Digital Industries Software today announced that Chipletz, an innovative fabless substrate startup, has selected Siemens as its strategic...
EuroHPC is to issue call next month for RISC-V chiplet projects in January with €270m of backing.
Eliyan’s chiplet interconnect technology enables connection of homogeneous & heterogenous architectures on a standard organic chip substrate.
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