Chiplets Semiconductor IP News & Insights

The Future of Chiplet Reliability

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YorChip and Siloxit Collaborate on Industry's First Secure Data Acquisition Chiplet for Mass Markets

YorChip, Inc. today announced an agreement to jointly develop the industry’s first secure Data Acquisition Chiplet for mass market applications...

Chiplets advancing one design breakthrough at a time

Where do the high-performance and highly scalable multi-die architectures for compute-intensive applications actually stand?

Are Chiplets Enough to Save Moore's Law?

During a press conference at Computex this week in Taiwan, Nvidia CEO Jensen Huang and MediaTek CEO Rick Tsai announced that Nvidia would be supplying...

Tenstorrent Partners with LG to Build AI and RISC-V Chiplets for Smart TVs of the Future

Tenstorrent and LG Electronics Inc. (LG) are pleased to announce that they are collaborating to build a new generation of RISC-V, AI, and video codec...

Chiplet Pioneer Eliyan Achieves First Silicon in Record Time with Implementation in TSMC 5nm Process, Confirms Most Efficient Chiplet Interconnect Solution in the Multi-Die Era

Eliyan's 40Gbps/bump chiplet interconnect silicon demonstrates the capability to achieve beachfront bandwidths up to 3Tbps/mm on standard organic...

Blue Cheetah Demonstrates Industry Leading Silicon-Proven Die-to-Die Interconnect Solution for Chiplets

Blue Cheetah Analog Design, the leader in rapidly customized die-to-die (D2D) interconnect IP solutions for chiplets, announced its latest successful...

Tenstorrent Selects Arteris IP for AI High-Performance Computing and Datacenter RISC-V Chiplets

Ncore and FlexNoC interconnect IP enable advanced Tenstorrent RISC-V computing for modular, efficient and performant next-generation AI at scale....

Alphawave Semi Showcases 3nm Connectivity Solutions and Chiplet-Enabled Platforms for High Performance Data Center Applications

Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity for the world’s technology infrastructure, today announced the bring-up of...

Fraunhofer IIS/EAS Selects Achronix Embedded FPGAs (eFPGAs) to Build Heterogeneous Chiplet Demonstrator

The Fraunhofer institute provides system concepts, design services and fast prototyping in most advanced packaging technologies and will make use...

The Future of Silicon Innovation in the Chiplet Era

The Future of Semi Innovation from Disruptive Memory to Chiplets with Alphawave Semi

TechArena host Allyson Klein chats with Alphawave Semi’s Letizia Guiliano about the future of semiconductor innovation across memory, optical and...