YorChip launches UniPHY™ - the first dual-use PHY for Chiplets
YorChip, Inc. today launched its patent pending UniPHY™️ dual-use PHY which enables developers to support both traditional Chiplet substrate-based...
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Chiplets Semiconductor IP News & Insights
Follow the latest news, technical articles, expert perspectives and ecosystem updates related to Chiplets and semiconductor IP design.
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163 results about Chiplets
Alphawave Semi Spearheads Chiplet-Based Custom Silicon for Generative AI and Data Center Workloads with Successful 3nm Tapeouts of HBM3 and UCIe IP
Alphawave Semi today announced two successful tapeouts on TSMC’s most advanced 3nm process of its High Bandwidth Memory 3 (HBM3) PHY and Universal...
The Future of Chiplet Reliability
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YorChip and Siloxit Collaborate on Industry's First Secure Data Acquisition Chiplet for Mass Markets
YorChip, Inc. today announced an agreement to jointly develop the industry’s first secure Data Acquisition Chiplet for mass market applications...
Chiplets advancing one design breakthrough at a time
Where do the high-performance and highly scalable multi-die architectures for compute-intensive applications actually stand?
Are Chiplets Enough to Save Moore's Law?
During a press conference at Computex this week in Taiwan, Nvidia CEO Jensen Huang and MediaTek CEO Rick Tsai announced that Nvidia would be supplying...
Tenstorrent Partners with LG to Build AI and RISC-V Chiplets for Smart TVs of the Future
Tenstorrent and LG Electronics Inc. (LG) are pleased to announce that they are collaborating to build a new generation of RISC-V, AI, and video codec...
Chiplet Pioneer Eliyan Achieves First Silicon in Record Time with Implementation in TSMC 5nm Process, Confirms Most Efficient Chiplet Interconnect Solution in the Multi-Die Era
Eliyan's 40Gbps/bump chiplet interconnect silicon demonstrates the capability to achieve beachfront bandwidths up to 3Tbps/mm on standard organic...
Blue Cheetah Demonstrates Industry Leading Silicon-Proven Die-to-Die Interconnect Solution for Chiplets
Blue Cheetah Analog Design, the leader in rapidly customized die-to-die (D2D) interconnect IP solutions for chiplets, announced its latest successful...
Tenstorrent Selects Arteris IP for AI High-Performance Computing and Datacenter RISC-V Chiplets
Ncore and FlexNoC interconnect IP enable advanced Tenstorrent RISC-V computing for modular, efficient and performant next-generation AI at scale....
Alphawave Semi Showcases 3nm Connectivity Solutions and Chiplet-Enabled Platforms for High Performance Data Center Applications
Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity for the world’s technology infrastructure, today announced the bring-up of...
Fraunhofer IIS/EAS Selects Achronix Embedded FPGAs (eFPGAs) to Build Heterogeneous Chiplet Demonstrator
The Fraunhofer institute provides system concepts, design services and fast prototyping in most advanced packaging technologies and will make use...
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