Will 1.4-nm help Samsung catch up with TSMC, IFS?
By Majeed Ahmad, EDN (November 6, 2023)
Samsung, playing a distant second to TSMC for quite some time, has vowed to launch the 1.4-nm chip manufacturing node by 2027, leapfrogging both TSMC and Intel Foundry Services (IFS) by a wide margin. The South Korean electronics conglomerate is also confident about producing the 2-nm chips in 2025 as planned.
Both 1.4 nm and 2 nm chips will be fabricated using the gate-all-around (GAA) technology that Samsung pioneered on its 3-nm chips released this year. Archrivals TSMC and IFS will transition from Fin field-effect transistors (FinFETs) to GAA transistors at their 2-nm nodes due for commercial launch in 2025 and 2024, respectively.
To read the full article, click here
Related Semiconductor IP
- Secure Boot Loader
- Memory Subsystem
- 4/8-bit mixed-precision NPU IP
- Compiler-centric single-core LPU
- SMC 2nm 1V8 ESD Power Clamp – Low Leakage
Related News
- TSMC 3-nm Upgrade in Japan to Catch up With Demand
- Leading edge technology company in India will Design, Build and License Semiconductor IP products and Services in 14nm Technology
- Samsung Electronics Unveils Plans for 1.4nm Process Technology and Investment for Production Capacity at Samsung Foundry Forum 2022
- Exec tried to set up copy-cat Samsung fab in China
Latest News
- SEMIFIVE Accelerates Growth with 97% YoY Revenue Surge in H1 2026, Powered by ASIC Turnkey, Mass Production, and IP
- Andes Technology has shut down Condor Computing
- TIER IV joins JST’s Next-Generation Edge AI Semiconductor R&D Program to open-source AI chip designs for autonomous driving
- BrainChip Partners With Orama.AOI For AI-Fueled Defect Detection
- PUFsecurity, subsidiary of eMemory, Advances Hardware-anchored Trust for AI Infrastructure at OCP APAC 2026