TSMC keynoter touts cooperative business models
Dylan McGrath, EE Times
(07/29/2009 2:51 AM EDT)
SAN FRANCISCO -- Future growth in EDA and other segments of the semiconductor industry supply chain depends on the evolution of a new breed of collaborative business model that enable partners to pool costs and increase profits, according to Fu-Chieh Hsu, vice president of Design & Technology Platform at leading foundry Taiwan Semiconductor Manufacturing Co. (TSMC).
Delivering a keynote address at the Design Automation Conference here Tuesday (July 28), Hsu said a community business model with tight partnerships could enable TSMC and ecosystem partners to collectively create greater value and get better returns by collaborating to reduce waste, development costs and maintenance overhead.
(07/29/2009 2:51 AM EDT)
SAN FRANCISCO -- Future growth in EDA and other segments of the semiconductor industry supply chain depends on the evolution of a new breed of collaborative business model that enable partners to pool costs and increase profits, according to Fu-Chieh Hsu, vice president of Design & Technology Platform at leading foundry Taiwan Semiconductor Manufacturing Co. (TSMC).
Delivering a keynote address at the Design Automation Conference here Tuesday (July 28), Hsu said a community business model with tight partnerships could enable TSMC and ecosystem partners to collectively create greater value and get better returns by collaborating to reduce waste, development costs and maintenance overhead.
To read the full article, click here
Related Semiconductor IP
- Dual Channel 8b D/A Converter - TSMC T40ULP
- Dual Channel 12b D/A Converter - TSMC T40ULP+ESF3
- 8bit D/A Converter - TSMC 22nm ULP
- 12bit 2MSps A/D Converter - TSMC T22ULP
- TSMC 2nm 1V2 GPIO
Related News
- Ausdia Joins TSMC Open Innovation Platform® (OIP) EDA Alliance
- M31 Advances AIoT Innovation with Ultra Low Power Memory Compilers on TSMC N6e Platform
- eMemory Recognized with 16th TSMC Open Innovation Platform® (OIP) Partner of the Year Award
- Agile Analog joins TSMC Open Innovation Platform IP Alliance Program
Latest News
- Brite Semiconductor Releases 28nm High-Performance SAR ADC IP, Driving Upgrades for High-Speed Signal Chain Applications
- Synopsys Updates CXL IP Portfolio for AI-Era Infrastructure
- BrainChip Launches Symphony Community Akida Bundle For IBM’s Workload Management Solution
- StarIC Appoints Dr. Masum Hossain as Chief Technology Officer
- Andes Technology Empowers RISC-V Developers with Its New Streamlined IDE, RVBuilder