Skyechip Joins Rapidus Core Ecosystem, Bringing Advanced Silicon IP For AI and HPC to Japan's 2nm Platform
KUALA LUMPUR – October 5, 2026 – SkyeChip Berhad (“SkyeChip” or the “Company”, and together with its subsidiaries, the “Group”), a Bursa Main Market-listed integrated circuit (“IC”) design company announced today that it has joined the Rapidus Collaborative Open Rapid Ecosystem (“Rapidus CORE”) of Rapidus Corporation (“Rapidus”) as a Design Solution Associate.
Rapidus was founded in 2022 as a Japan-based semiconductor manufacturing company to produce cutting-edge 2-nanometer chips by 2027, aiming to strengthen the country’s domestic semiconductor supply and industrial competitiveness.
Rapidus CORE was established as a global ecosystem framework to support the development and mass production of cutting-edge semiconductors.
Under the collaboration, SkyeChip will contribute its advanced silicon intellectual property (“IP”) for artificial intelligence (“AI”) and high-performance computing (“HPC”) applications, together with its IC design expertise, to support customers developing next-generation AI and HPC chips on Rapidus' process technologies.
As AI workloads grow, the speed at which data moves through and between chips has become one of the main limits on system performance, and SkyeChip's IP is designed to address it.
The appointment places SkyeChip within Rapidus’ ecosystem for leading-edge silicon. It reflects the strength of the Group's AI and HPC IP portfolio and its track record of delivering advanced IC design to global customers.
“Being appointed to Rapidus CORE recognises the depth of SkyeChip's silicon IP for AI and HPC, and our engineering capability in leading-edge chip design. We look forward to working with Rapidus to help customers bring advanced AI and HPC silicon to market faster. This is an important milestone in SkyeChip's journey to become a global silicon IP and silicon products company from Malaysia” said Dato’ Fong Swee Kiang, Chief Executive Officer of SkyeChip Berhad.
Explore Skyechip IP:
About SkyeChip Berhad
SkyeChip Berhad (Bursa Malaysia: SKYECHIP, Stock Code: 5357) is a Malaysia-based global silicon IP and silicon products company. Commencing business in 2020, SkyeChip’s silicon IP portfolio includes high-bandwidth memory interface IP, Network-on-Chip IP and D2D interface IP, supporting applications across high-performance computing and AI. SkyeChip has developed over 120 patent inventions, filed across Malaysia, China and the United States. For more information, visit www.skyechip.com.
Related Semiconductor IP
- HBM3 PHY & Controller
- UCIe PHY & Controller
- Non-Coherent Network-on-Chip (NOC)
- Low Power RISCV CPU IP
- High Bandwidth Memory 3 (HBM3/3E) IP optimized for Samsung SF4X
Related News
- Rapidus Unveils “Rapidus CORE”, New Global Ecosystem Framework Supporting the Development and Mass Production of Cutting-Edge Semiconductors
- Consortium forms Rapidus to get Japan back into chip race at 2nm
- BrainChip Pushes the Edge in 2023 with Akida Innovations, Expanded Partner Ecosystem
- Consortium's Move Will Boost RISC-V Ecosystem, Thankfully
Latest News
- Skyechip Joins Rapidus Core Ecosystem, Bringing Advanced Silicon IP For AI and HPC to Japan's 2nm Platform
- GUC Monthly Sales Report – September 2026
- Rapidus Unveils “Rapidus CORE”, New Global Ecosystem Framework Supporting the Development and Mass Production of Cutting-Edge Semiconductors
- JEDEC® Publishes First Industry-Wide Silicon Photonics Reliability Standard for AI, Datacenter and Telecom Infrastructure
- Orthogone Technologies Launches Ultra-Low-Latency FPGA IP Portfolio for Multi-Industry Deterministic Networking