Vendor: SkyeChip Category: HBM

HBM3 PHY & Controller

Bandwidth and area optimized low power memory interface solution tuned for AI, HPC, data centers and networking conforming to HBM…

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Controller + PHY TSMC 7nm N7 View all specifications

Overview

Bandwidth and area optimized low power memory interface solution tuned for AI, HPC, data centers and networking conforming to HBM3 (JESD238A) JEDEC standards

Key features

  • One stop PHY & Controller solution with an average random efficiency of more than 85%
  • Supports up to 6400 MT/s for HBM3 and up to 9600 MT/s for HBM3E
  • DFI 5.1 compatible interface to the memory controller
  • Flexible PHY with programmable intelligent interface training sequences
  • Flexible IEEE1500 interface to support memory vendor customizations
  • Supports up to 32Gb density per die
  • Supports up to 16H HBM3 DRAM stacks
  • Supports major 2.5D/3D packaging technologies including support for interposer designs and interconnect and memory repairs
  • Add-on features/engines for MPFE, RAS and Debug available upon request
  • Add-on feature for generic 2.5D die-to-die data transport interconnect

Applications

  • Data center and networking
  • High performance computing (HPC)
  • Artificial intelligence (AI)
  • High-end graphics

What’s Included?

  • Executable .run installation file
  • GDSII, LEF Files, LVS netlists, .lib/.db
  • timing models, Verilog model, DRC/LVS log files, I/O IBIS model, I/O HSPICE netlist, parameterized Verilog top-level PHY netlist files
  • sample verification environment, PHY data book
  • physical implementation guide, application notes, verification guide, installation guide, implementation checklist
  • The PHY Utility Block includes Verilog code, synthesis/STA constraints and scripts, sample verification environment, data book

Silicon Options

Foundry Node Process Maturity
TSMC 7nm N7 —

Specifications

Identity

Part Number
HBM3 PHY & Controller
Vendor
SkyeChip
Type
Silicon IP
Controller / PHY
Controller + PHY

Files

Product Sheet Download

Note: some files may require an NDA depending on provider policy.

Provider

SkyeChip
HQ: Malaysia
Contact SkyeChip

Learn more about HBM IP core

Reducing Avoidable Memory Trips In HBM Systems

As AI and high-performance SoCs increasingly rely on HBM, memory bandwidth alone is no longer enough to maximize performance. This article discusses why the intelligent data movement and cache efficiency are critical to unlocking the full benefits of HBM-based architectures.

Making Strong Error-Correcting Codes Work Effectively for HBM in AI Inference

LLM inference is increasingly memory-bound, and HBM cost per GB now dominates system cost. Today’s HBM stacks include short on-die ECC, which tightens binning, raises price, and locks reliability policy inside the device. This paper asks a simple question: can we tolerate a much higher raw HBM bit error rate (BER) and still keep end-to-end correctness and throughput, without changing the HBM PHY or the fixed 32B transaction size?

High Bandwidth Memory Evolution from First Generation HBM to the Latest HBM4

HBM4 is the latest generation of the High Bandwidth Memory (HBM) that has become analogous to the Artificial Intelligence (AI) boom that is everywhere in today’s world. HBM is also increasingly being used in other applications like Data centers, autonomous driving systems, servers, cloud computing just to mention few domains where bandwidth and performance in a key requirement.

Breaking the HBM Bit Cost Barrier: Domain-Specific ECC for AI Inference Infrastructure

High-Bandwidth Memory (HBM) delivers exceptional bandwidth and energy efficiency for AI workloads, but its high cost per bit, driven in part by stringent on-die reliability requirements, poses a growing barrier to scalable deployment. This work explores a systemlevel approach to cost reduction by eliminating on-die ECC and shifting all fault management to the memory controller.

Frequently asked questions about HBM Interface IP

What is HBM3 PHY & Controller?

HBM3 PHY & Controller is a HBM IP core from SkyeChip listed on Semi IP Hub. It is listed with support for tsmc.

How should engineers evaluate this HBM?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this HBM IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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