Intersil files SOI suit against Soitec
Mark LaPedus
EE Times
(11/02/2005 4:40 PM EST)
SAN JOSE, Calif. — Intersil Corp. has filed a suit against France’s Soitec S.A. over alleged infringement of silicon-on-insulator (SOI) patents.
The suit, filed in the U.S. District Court for the Eastern District of Texas on Oct. 27, alleges that Soitec is infringing upon Intersil’s patent using “a rapid thermal process for manufacturing a wafer bonded silicon-on-insulator semiconductor,” according to court documents. The patent involved is U.S. Patent No. 4,771,016.
EE Times
(11/02/2005 4:40 PM EST)
SAN JOSE, Calif. — Intersil Corp. has filed a suit against France’s Soitec S.A. over alleged infringement of silicon-on-insulator (SOI) patents.
The suit, filed in the U.S. District Court for the Eastern District of Texas on Oct. 27, alleges that Soitec is infringing upon Intersil’s patent using “a rapid thermal process for manufacturing a wafer bonded silicon-on-insulator semiconductor,” according to court documents. The patent involved is U.S. Patent No. 4,771,016.
To read the full article, click here
Related Semiconductor IP
- TSMC 7nm 0V75 / 0V9 ESD Local Clamp – Low Cap
- TSMC 65nm 3V3 ESD Local Clamp – Rad Hard
- TSMC 5nm 1V8, 1.2V and 0.9V ESD Local Protection – Low Cap
- TSMC 3nm 3V3 ESD Local Clamp
- TSMC 3nm 1V2 ESD Local Clamp – Low Capacitance
Related News
- MEMC Conducts Seizure and Files Suit Against Soitec for Patent Infringement
- Soitec files for declaratory relief in U.S. Court against MEMC
- Soitec Reaffirms Commitment to Support Taiwanese Foundries' Move Toward Production on SOI
- Rambus Files Patent Infringement Suit Against Use of Its Inventions by DDR2 and GDDRx Products
Latest News
- First Benchmarks Revealed for Jalapeño, OpenAI’s Clean-Sheet General Purpose AI Accelerator ASIC
- MIPS Leads Open Standards Development for Physical AI Platforms as RISC-V International Premier Member
- SEALSQ’s Subsidiary IC'Alps Advances QASIC Roadmap for Sovereign, Quantum-Resistant Application-Specific Integrated Circuits
- NVMe 2.4 Update Adds Post-Quantum Security, Power Controls
- Agentrys Raises $24.5 Million to Build Agentic Design Automation for Chipmakers