Soitec files for declaratory relief in U.S. Court against MEMC
Bernin, France, November 22, 2005 - Soitec, the world’s leading supplier of silicon-on-insulator (SOI) wafers and other engineered substrates for the semiconductor industry, today announced it has filed for declaratory relief in the U.S. District Court of Delaware in response to allegations of patent infringement made by MEMC Electronic Materials, Inc. In a complaint filed on November 21, 2005, Soitec stipulates that it does not infringe on any of MEMC’s patents involving the production and use of so-called ‘COP-free silicon’, in the fabrication of SOI wafers, and that in addition, these patents are not valid under U.S. law.
André-Jacques Auberton-Hervé, Soitec's CEO, said: “We offered to discuss our position with MEMC but they replied that they did not want to debate these issues with us. In the face of their allegations and threats, we had no choice but to ask the Court to intervene. We are confident that the Court will sustain our position.”
André-Jacques Auberton-Hervé, Soitec's CEO, said: “We offered to discuss our position with MEMC but they replied that they did not want to debate these issues with us. In the face of their allegations and threats, we had no choice but to ask the Court to intervene. We are confident that the Court will sustain our position.”
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related News
- MEMC Conducts Seizure and Files Suit Against Soitec for Patent Infringement
- Intersil files SOI suit against Soitec
- California Court Grants MOSAID'S Motion to dismiss Micron's complaint for declaratory judgment
- Federal Trade Commission Files Petition for Certiorari in the Supreme Court in Rambus Case
Latest News
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release
- IC Manage Advances GDP-AI for Custom IC Design with Virtuoso