Gen-Z Seeks to Share Memory, Lower Latencies
By Gary Hilson, EETimes (July 30, 2020)
Not to be confused with the demographic cohort that succeeds millennials, Gen-Z is a memory-semantic fabric architecture that’s at a point where it must better define how it fits within the greater scheme of specifications and standards, including the somewhat mature NVM Express and the emerging Compute Express Link (CXL) protocol that’s gaining traction in data centers.
Gen-Z uses memory-semantic communications to move data between memories on different components with minimal overhead, not only interconnecting memory devices, but also processors and accelerators, the latter of which are becoming increasingly popular for specific use cases — storage and artificial intelligence, for example — while taking pressure of the CPU. Ultimately, Gen-Z is about more flexibility and responsiveness when it comes to resource provisioning and sharing, allowing systems to be reconfigured as the demands of applications for different resources change.
To read the full article, click here
Related Semiconductor IP
- GENZ VIP
- Gen-Z Switch IP Core
- Gen-Z Link Layer IP Core
- Gen-Z Physical Layer for PCIe IP Core
- Gen-Z Physical Layer for 802.3 IP Core
Related News
- Imec achieves breakthroughs in ferroelectric memory research for next-generation memory solutions to meet AI-era data needs
- Kandou AI Selects Baya Systems to Power Its Attack on the AI Memory Wall
- NEO Semiconductor Launches NEO.AI Memory Platform to Solve AI’s Two Biggest Memory Bottlenecks
- TeRAM Emerges from Stealth with $37M Equity Raise to Tackle the AI Memory Wall
Latest News
- Vayavya Labs and Tenstorrent Partner to Accelerate RISC-V Hardware and Software Development Through Virtual Platform Modeling
- RaiderChip’s Edge NPU reaches more than 50 Generative AI Models with the addition of Qwen3.8-27B
- Aion Silicon Named Design Solution Associate in New Rapidus CORE Ecosystem for 2nm Semiconductors
- Arteris Wins Funding to Expand Hardware Design Supply Chain Security Assurance for the Trusted and Assured Microelectronics Program
- UMC Reports Sales for September 2026