DSP Group to launch 'total solutions' for all cordless phones at CES
DSP Group to launch 'total solutions' for all cordless phones at CES
By Semiconductor Business News
January 4, 2002 (1:00 p.m. EST)
URL: http://www.eetimes.com/story/OEG20020104S0050
SANTA CLARA, Calif. -- DSP Group Inc. plans to roll out a comprehensive series of digital signal processor-based chip solutions for a full range of digital cordless telephones at the Consumer Electronics Show in Las Vegas next week (Jan. 8-11). The Santa Clara-based company will call the DSP-based offering the "Total Telephone Solutions" architecture. The new series will licensable DSP cores for all types of consumer wireless telephones--from the integrated feature telephone to digital narrow-band coreless phones and spread spectrum multi-line, multi-handset products, according to the company this week. Each family in the DSP solution will allow a "seamless upgrade from the very basic caller ID phones to fully-featured models with advanced voice recognition, speech synthesis and more," said DSP Group. The company did not release specific pricing information on the solutions, but it said the cores and technology are available for mass produc tion. "Total Telephony Solutions is our conceptual architectural approach,allowing our customer to achieve the best time-to-market, product cost/performance ratio and differentiating versatility, all at the same time," said Victor Koretsky, vice president of sales and marketing at DSP Group. He said these new solutions covers will cover all available standards for "contemporary telephony." "As the market price of telephones continuously decreases, more and more telephone manufacturers realize the value of digital vs. analog cordless telephony," Koretsky said. "Ultimately, security and better range are distinctive factors of digital cordless solutions. In addition, our DSP-based baseband processor technology is a key enabling factor for such unique features as 'True Full-Duplex Speakerphone' in both base units and handsets, digital TDD filter and adaptive electrical echo cancellation," he added.
Related Semiconductor IP
- Ultra Ethernet MAC & PCS 100G/200G/400G/800G
- Ethernet PCS 100G/200G/400G/800G/1.6T
- Ethernet MAC 100G/200G/400G/800G/1.6T
- Junction Over-Temperature Detector with Linear Centigrade-to-Voltage Output - X-FAB XT018
- Performance P570 Gen 3
Related News
- Arasan announces its Total MIPI Soundwire IP Solution with the launch of its Soundwire PHY IP
- Imagination and Realtek launch world-first image compression DTV SoC
- Imagination's IMG DXT GPU unlocks scalable, premium ray tracing for all mobile gamers
- BrainChip and NVISO Group Demonstrate AI-Enabled Human Behavioral Analysis at CES 2024
Latest News
- SkyeChip Berhad Delivers 35.0% Net Profit Growth Ahead of Main Market Debut on 20 May 2026
- Quantum eMotion and JMEM TEK Sign Consortium Agreement to Accelerate Quantum-Resilient Semiconductor SoC Development
- Silvaco Announces Immediate Availability of Mixel MIPI C-PHY/D-PHY Combo IP on TSMC N2P Process
- BrainChip Strikes IP Licensing Deal with ASICLAND
- Arteris Technology Adopted by Li Auto for Intelligent Vehicles