ASICLAND to Showcase AxHub™ and Mass-Produced Chips at TSMC OIP Forum

• Supporting TSMC’s “Expanding AI with Leadership Ecosystem” theme by showcasing design and volume production solutions for the AI era
• Enhancing development efficiency through AxHub™, a proprietary I/O platform for AI applications, and ASIC turnkey solutions
• Showcasing mass-produced chips to highlight end-to-end execution capabilities from design to commercialization

September 21, 2026 -- ASICLAND will showcase AxHub™, its proprietary I/O platform for AI applications, alongside its ASIC turnkey solutions and mass-produced chips at TSMC’s global Open Innovation Platform (OIP) forum.

The company announced on September 21 that its exhibition booth will focus on three key areas: ASIC turnkey solutions, its proprietary AxHub™ platform for AI applications, and mass-produced chips.

ASICLAND’s ASIC turnkey solutions provide integrated support across the semiconductor development lifecycle, from initial specification definition and back-end design to wafer fabrication, packaging, and production testing. As AI and high-performance computing (HPC) semiconductors advance in performance and integration density, design complexity and development demands continue to grow. ASICLAND offers comprehensive capabilities to help customers efficiently navigate the entire process, from product development to volume production.

Developed in-house, AxHub™ is a next-generation I/O (Input/Output) platform for AI applications, designed to help global fabless companies shorten development cycles and optimize their designs. With TSMC emphasizing reduced design complexity and faster time-to-market as key priorities for this year’s OIP, ASICLAND will demonstrate how AxHub™ can help customers develop core functions more efficiently and accelerate product commercialization.

The exhibition will feature physical samples of FADU’s mass-produced, high-performance chips, for which ASICLAND contributed to both design and volume production. By showcasing actual chips that demonstrate its experience in translating customer designs into silicon and supporting volume production, ASICLAND aims to give global semiconductor industry participants a clearer understanding of its end-to-end project execution capabilities.

ASICLAND plans to expand technical exchanges across the global semiconductor ecosystem and create further opportunities for collaboration with prospective customers and partners. By presenting its proprietary platform, ASIC turnkey solutions, and mass-produced chips together, the company will highlight its ability to carry projects from design through commercialization and volume production. It will also explore opportunities for technical and business collaboration on future global projects.

“As AI semiconductors become increasingly sophisticated, the ability to reliably translate complex designs into working products and volume production is becoming increasingly important, alongside advanced process and packaging technologies,” an ASICLAND representative said. “At this year’s TSMC OIP forum, we will introduce global customers to the ASIC design and volume production experience accumulated by our headquarters in Korea, as well as our proprietary platform capabilities, while expanding technical exchanges with partners across the semiconductor ecosystem.”

ASICLAND is the only TSMC Value Chain Alliance (VCA) partner in Korea. The company provides design solutions spanning the entire semiconductor development lifecycle, including ASIC design, verification, tape-out, process technology support, and volume production.