M31 Board Approves Private Placement to Bring in ASPEED as Strategic Investor 2026-08-06 06:24:00 Companies & Startups
Global IP Core Launches Licensable Zigbee Transceiver PHY IP Core 2026-08-05 13:32:00 IP Cores & Design
Samsung Unveils Next-Gen 3D-Memory Vision at FMS 2026, Charting the Future of AI Infrastructure 2026-08-05 04:51:19 Technology & Integration
NEO Semiconductor Launches NEO.AI Memory Platform to Solve AI’s Two Biggest Memory Bottlenecks 2026-08-04 15:05:05 Technology & Integration
Ceva and Actions Technology Collaborate to Bring Bluetooth HDT Audio Chips to Market 2026-08-04 14:56:44 Commercial Deals
New 3D Flash Memory Technology from Kioxia and Sandisk Achieves Industry’s Highest Bit Density for QLC NAND 2026-08-04 14:44:00 Technology & Integration
NVM Express Publishes Set of NVMe Specifications Enhancing Security, Manageability and Sustainability for AI, Cloud, Enterprise and Client Storage 2026-08-04 14:35:55 Standards & Interconnects
Andes Technology Unveils Next-Generation AI Solutions: AndesAIRE™ AnDLA™ I370 v2.0 and NN SDK v1.2.0 for Advanced ViT, VLM, and SLM at the Edge 2026-08-03 14:55:04 IP Cores & Design
AccelerComm Powers Eclipse Space’s 5G Physical Layer for Sovereign Satellite Constellations 2026-07-30 14:29:40 Commercial Deals
SEMI Reports Worldwide Silicon Wafer Shipments Increase 7.4% Year-on-Year in Q2 2026 2026-07-29 14:08:19 Analysis & Insight
ChipAgents Expands Series A Funding to $134 Million as Demand Grows for Agentic AI in Semiconductor Design 2026-07-29 12:10:54 Funding & Investments
UMC Announces Fab Expansion in Singapore and Construction of New Fab in Tainan to Meet Accelerating AI Demand 2026-07-29 08:57:25 Foundries & Process Nodes