TES is extending its on-chip sensor IP portfolio
2026-05-14 07:30:56
IP Cores & Design
Semiconductor IP News Archive - Page 7 of 1956
UMC Announces Release of 14nm eHV FinFET Platform, Advancing Innovation in Next-Generation Smartphone Displays
2026-05-14 06:23:00
Foundries & Process Nodes
Weebit Nano raises $15 million via strongly supported SPP
2026-05-14 06:05:34
Funding & Investments
Fractile raises $220M to build the next generation of inference hardware
2026-05-13 14:50:00
Funding & Investments
QuickLogic Announces New Seven-Figure FPGA Hard IP Contract
2026-05-13 11:14:00
Commercial Deals
Siemens democratizes EDA software access for European electronics industry through the Chips JU European Chips Design Platform (EuroCDP) project
2026-05-13 06:40:00
EDA & Design Tools
Siemens unveils AI-powered library characterization to accelerate semiconductor design
2026-05-13 06:34:52
EDA & Design Tools
Arteris Announces Financial Results for the First Quarter and Estimated Second Quarter and Updated Full Year 2026 Guidance
2026-05-13 06:17:42
Financials
FotoNation and SEMIFIVE Announce Strategic Collaboration for Turnkey Development of TriSilica Perceptual AI Chip Family Using Samsung Foundry
2026-05-13 05:53:28
Ecosystem Landscape
QuickLogic Reports Fiscal First Quarter 2026 Financial Results
2026-05-13 05:44:00
Financials
Apple-Intel Foundry Deal Could Reshape U.S. Chip Manufacturing
2026-05-12 13:56:51
Analysis & Insight
SiFive Sets New Bar for High-Performance RISC-V with Third-Generation Performance P550 and P570 IP
2026-05-12 13:23:00
IP Cores & Design
Imec demonstrates the first 3D implementation of a charge coupled device for AI memory applications
2026-05-12 11:37:50
Research Institutions
EXTOLL announces Availability of Industry's first 16G UCIe PHY IP in GlobalFoundries 22FDX/22FDX+ Ready for Customer Integration
2026-05-12 11:11:00
IP Cores & Design
Development of High-Precision Nonvolatile Analog Computing-in-Memory Technology Enabling Ultra-Low-Power AI Hardware
2026-05-12 06:12:00
Research Institutions
Chips&Media Completes Development of Next-Gen 'AV2' HW Decoder IP
2026-05-12 03:53:06
IP Cores & Design
Aeva Adopts Cadence Tensilica Vision DSP to Advance Lidar Performance and Efficiency
2026-05-11 13:43:11
Commercial Deals
Ceva, Inc. Announces First Quarter 2026 Financial Results
2026-05-11 11:53:19
Financials
Ceva Advances Full-Stack Wireless Vision with Next Generation Bluetooth High Data Throughput and Integrated RF Design Win
2026-05-11 11:26:59
Strategic Partnerships
OSYX Technologies and Andes Technology Announce Strategic Collaboration on RISC-V Virtualization
2026-05-11 06:15:39
Strategic Partnerships