InterDigital Signs Cinterion to Worldwide Patent License Agreement
License Agreement Covers 2G, 3G M2M Modules and PC Cards
KING OF PRUSSIA, Pa., Sep 18, 2009 -- InterDigital, Inc. (NASDAQ: IDCC) today announced that its patent holding subsidiaries have entered into a worldwide, non-transferable, non-exclusive, royalty-bearing patent license agreement with Cinterion Wireless Modules GmbH ("Cinterion"). The agreement covers the sale of Machine-to-Machine (M2M) modules and PC Cards compliant with 2G and 3G cellular standards, for the period January 1, 2009 through the end of 2012.
"This agreement further expands the licensing of InterDigital's current 2G and 3G patents into new areas of opportunity such as the fast-growing M2M market," commented Lawrence Shay, President of InterDigital's patent holding subsidiaries. "Cinterion holds a substantial portion of the growing overall M2M module market."
Cinterion, headquartered in Munich, Germany, is the worldwide leading supplier of cellular M2M communication modules that enable machines, equipment and vehicles to communicate over wireless networks, helping enterprises dramatically cut costs and increase productivity and efficiency. The company's products are used for remote maintenance and control; metering; payment systems; industrial PDAs; routers and gateways; security systems; health care; automotive and eToll; tracking and tracing; environmental monitoring and more.
About InterDigital
InterDigital(R) designs, develops and provides advanced wireless technologies and products that drive voice and data communications. InterDigital is a leading contributor to the global wireless standards and holds a strong portfolio of patented technologies which it licenses to manufacturers of 2G, 2.5G, 3G, and 802 products worldwide.
For more information, on InterDigital, please visit: www.interdigital.com.
Related Semiconductor IP
- ONFI/Toggle IP
- 8 - 24MHz Xtal Oscillator on TSMC 22nm
- 32kHz Xtal Oscillator on TSMC 22nm
- 1.056GHz SSCG PLL on TSMC 40nm
- 1.25GHz Multiplying PLL on TSMC 40nm
Related News
- Rambus and Kioxia Renew Patent License Agreement
- Rambus and Socionext Renew Patent License Agreement
- pSemi Resolves Litigation and Enters Patent License Agreement
- InterDigital Signs ModeLabs to Worldwide 2G and 3G Patent License Agreement
Latest News
- SiFive Paves the Path to Accelerated Adoption of RISC-V in the Datacenter with the BigSky Development Server
- Perceptia Releases Design Kit for pPLL03 on Samsung Foundry 14LPU Platform
- Brite Semiconductor Releases 28nm High-Performance SAR ADC IP, Driving Upgrades for High-Speed Signal Chain Applications
- Synopsys Updates CXL IP Portfolio for AI-Era Infrastructure
- BrainChip Launches Symphony Community Akida Bundle For IBM’s Workload Management Solution