InterDigital Signs ModeLabs to Worldwide 2G and 3G Patent License Agreement

KING OF PRUSSIA, Pa. -- Dec 29, 2008 -- InterDigital, Inc. today announced that its patent licensing subsidiaries have signed a non-exclusive, worldwide, royalty-bearing patent license agreement with Paris-based ModeLabs Group. The agreement covers the sale of certain wireless terminal units and infrastructure built to the Second Generation (2G and 2.5G) and/or Third Generation (3G) cellular standards and/or the non-cellular wireless IEEE 802-based standards, for the duration of the life of the licensed patents.

ModeLabs Group is a customized design manufacturer (CDM) that leverages flexible, integrated processes to design, develop and distribute mobile phones, accessories, and services for operators, retailers and major brands.

"This new agreement with one of Europe's most creative mobile device companies expands InterDigital's licensing coverage in Europe and allows us to participate in a growing and innovative segment of the market," commented Lawrence Shay, President of InterDigital's patent subsidiaries.

About InterDigital

InterDigital designs, develops and provides advanced wireless technologies and products that drive voice and data communications. InterDigital is a leading contributor to the global wireless standards and holds a strong portfolio of patented technologies which it licenses to manufacturers of 2G, 2.5G, 3G, and 802 products worldwide. Additionally, the company offers a family of SlimChip^(TM) high performance mobile broadband modem solutions, consisting of Baseband ICs, Modem IP and Reference Platforms. InterDigital's differentiated technology and product solutions deliver time-to-market, performance and cost benefits.

InterDigital is a registered trademark and SlimChip is a trademark of InterDigital, Inc.

For more information, visit: www.interdigital.com