Top 10 Highlights of the TSMC 2018 Technology Symposium
Here are the Top 10 highlights from the recent TSMC 2018 Technology Symposium, held in Santa Clara CA. A couple of years ago, TSMC acknowledged the unique requirements of 4 different market segments, which has since guided their process development strategy -- Mobile, High-Performance Computing (HPC), Automotive, and IoT. Many of the highlights described below are in the context of a specific platform.
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Related Semiconductor IP
- Ultra-Low Latency 32Gbps SerDes IP in TSMC 12nm FFC
- Ultra-Low Latency 32Gbps SerDes IP in TSMC 22nm ULP
- 32Gbps SerDes IP in TSMC 12nm FFC
- 32Gbps SerDes IP in TSMC 22nm ULP
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
Related Blogs
- TSMC Technology Symposium 2018
- Key Takeaways from the TSMC Technology Symposium Part 1
- TSMC Technology Symposium: Process Status
- Key Takeaways from the TSMC Technology Symposium Part 2
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