Developing the Skill Set Required for SystemC TLM-Based Hardware Design and Verification
I've written a lot about the benefits of moving hardware design and verification up in abstraction from RTL to SystemC with transaction-level models (TLM). We have seen many customers speed their overall design and verification turnaround by 2x. A recent article described Fujitsu Semiconductor's experience -- 35% better performance, 35% smaller area, 51% less power and faster turnaround time.
The benefits of moving up in abstraction are summarized by the following graph, which shows the leaps in productivity for every leap in abstraction:
To read the full article, click here
Related Semiconductor IP
- TSMC 7nm 0V75 / 0V9 ESD Local Clamp – Low Cap
- TSMC 65nm 3V3 ESD Local Clamp – Rad Hard
- TSMC 5nm 1V8, 1.2V and 0.9V ESD Local Protection – Low Cap
- TSMC 3nm 3V3 ESD Local Clamp
- TSMC 3nm 1V2 ESD Local Clamp – Low Capacitance
Related Blogs
- Design, Verification, and Software Development Decisions Require a Single Source of Truth
- Importance Of Hardware Security Verification In Pre-Silicon Design
- IDS-Verify™: From Specification to Sign-Off – Automated CSR, Hardware Software Interface and CPU-Peripheral Interface Verification
- AI in Design Verification: Where It Works and Where It Doesn’t
Latest Blogs
- Beyond Trusted: What the NSA’s New Guidance Means for Hardware Security
- A scalable, shader-programmable vector graphics GPU core for low-power MCUs
- Navigating ISO 26262 Part 11: A Guide for Semiconductor Architects
- Embedded Security explained: Digital signatures
- Hardware security verification must go beyond functional testing