SoC design in China and the future for 28nm
The state of SoC design in China is a difficult subject to research, but it is a question of vital interest to many designers and managers in the rest of the world. In recent weeks we have seen a couple of data points that suggest an interesting and fluid picture.
One point comes from Open-Silicon, which recently collaborated with two companies from the People's Republic on a very substantial design. The chip was a 100 Mgate wireless networking SoC done in TSMC 65nm CMOS. Virtually all the RTL was developed at Open-Silicon's customer, Shenzhen-based HiSilicon. The physical design was a collaboration between a team of Open-Silicon engineers and a team at Brite Semiconductor in Shanghai.
The second data point comes from Taiwan-based fabless ASIC
house Global Unichip. Director of marketing Keh-Ching Huang says that the company is currently engaged in several 28nm designs planned for tapeout next year. Some of these engagements are with mainland Chinese companies.
To read the full article, click here
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related Blogs
- How many 28nm FDSOI SoC Design Starts in 2015? In 2020?
- Delivering a Secure, Cloud-Based SoC Design Environment for Aerospace Chip Designers
- Customer Spotlight: Viettel Accelerates Design of Its First 5G SoC with Synopsys ASIP Designer
- How to Augment SoC Development to Conquer Your Design Hurdles
Latest Blogs
- AI in Design Verification: Where It Works and Where It Doesn’t
- PCIe 7.0 fundamentals: Baseline ordering rules
- Ensuring reliability in Advanced IC design
- A Closer Look at proteanTecs Health and Performance Management Solutions Portfolio
- Enabling Memory Choice for Modern AI Systems: Tenstorrent and Rambus Deliver Flexible, Power-Efficient Solutions