How many 28nm FDSOI SoC Design Starts in 2015? In 2020?
I would like to further discuss this graphic (presented during IP-SoC 2014 by John Koeter, VP of Marketing IP and prototyping, Synopsys) and focus on Active Design and Tapeouts at 28nm. In fact the very first activity appeared in Q1 2007, but it was only during 2010 that 28nm become popular, after the first Tapeouts coming in Q1 and an average number of active designs per quarter being around 75, to climb to 100 ranges during 2011 and 2012. To really understand this graphic we need to remember that the active design and Tapeouts numbers stop being reported in the graphic, but still exists in the real life! These numbers may still grow, and considering the 28/32nm shape, I would guess so. As you know, before going into production, an IC passes through active design (18 to 24 months), then Tapeout/prototyping/validation (another 6 to 12 months) before production ramp-up and full production. In other words, the active designs listed in Q4 2012 are most probably not yet into production today!
To read the full article, click here
Related Semiconductor IP
- TSMC 7nm 0V75 / 0V9 ESD Local Clamp – Low Cap
- TSMC 65nm 3V3 ESD Local Clamp – Rad Hard
- TSMC 5nm 1V8, 1.2V and 0.9V ESD Local Protection – Low Cap
- TSMC 3nm 3V3 ESD Local Clamp
- TSMC 3nm 1V2 ESD Local Clamp – Low Capacitance
Related Blogs
- The 5 Biggest Challenges in Modern SoC Design (And How to Solve Them)
- How to Augment SoC Development to Conquer Your Design Hurdles
- 2024 Set The Stage For NoC Interconnect Innovations In SoC Design
- As Vehicles Become Data Centers: Why Interface IP Integration Matters in SoC Design
Latest Blogs
- Beyond Trusted: What the NSA’s New Guidance Means for Hardware Security
- A scalable, shader-programmable vector graphics GPU core for low-power MCUs
- Navigating ISO 26262 Part 11: A Guide for Semiconductor Architects
- Embedded Security explained: Digital signatures
- Hardware security verification must go beyond functional testing