Semicon West: The Roadmap is 3D IC
Semicon West: all roads lead to 3D IC, and 'More than Moore.'
This year Semicon West had a clear undertone — the roadmap forward is 3D IC. Yes, we can and we will keep pushing dimensions down, which for a few applications would be attractive, but for most designs the path forward would be “More than Moore.” As Globalfoundries' CEO Jha recently voiced: “it's clear that More-than-Moore is now mainstream rather than niche. …Really it is leading-edge pure digital that is the niche. Instead the high-cost leading edge processes are really niche processes optimized for applications in data centers or for high computational loads, albeit niches with volumes of hundred of millions of units per year.” Similarly, EE Times editor Rick Merritt subtitled his Semicon West summary Roadmap being drawn for chip stacks.
To read the full article, click here
Related Semiconductor IP
- Zigbee Transceiver PHY
- Data Flow Architecture IP
- AMBA SPI Controller MRAM Controller
- Ethernet MAC
- Protocol Bridges
Related Blogs
- Want a peek at a possible Qualcomm 3D IC roadmap?
- Designing the Beam Steering Core for a C-Band AESA: A Look at VSI's VBF0644 GaAs Beamformer IC
- Why 28nm is the New Strategic Node?
- What's driving 3D IC design? Do 2D EDA tools need a total overhaul to support 3D design?
Latest Blogs
- IDS-NoC: A Scalable Interconnect Solution for Modern SoC Design
- Leading-edge AI IC designs demand comprehensive HAV methodologies
- Beyond the Fab: Building Europe’s Next Generation of Semiconductor Champions
- AI Semiconductor Design at 3nm and 2nm: Silicon-Proven IP
- Samsung Foundry and Cadence Expand Infrastructure and Physical AI Solution