Semicon West: The Roadmap is 3D IC
Semicon West: all roads lead to 3D IC, and 'More than Moore.'
This year Semicon West had a clear undertone — the roadmap forward is 3D IC. Yes, we can and we will keep pushing dimensions down, which for a few applications would be attractive, but for most designs the path forward would be “More than Moore.” As Globalfoundries' CEO Jha recently voiced: “it's clear that More-than-Moore is now mainstream rather than niche. …Really it is leading-edge pure digital that is the niche. Instead the high-cost leading edge processes are really niche processes optimized for applications in data centers or for high computational loads, albeit niches with volumes of hundred of millions of units per year.” Similarly, EE Times editor Rick Merritt subtitled his Semicon West summary Roadmap being drawn for chip stacks.
To read the full article, click here
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related Blogs
- Want a peek at a possible Qualcomm 3D IC roadmap?
- What's driving 3D IC design? Do 2D EDA tools need a total overhaul to support 3D design?
- Intel Calls for 3D IC
- SEMICON West - Globalfoundries Update
Latest Blogs
- AI in Design Verification: Where It Works and Where It Doesn’t
- PCIe 7.0 fundamentals: Baseline ordering rules
- Ensuring reliability in Advanced IC design
- A Closer Look at proteanTecs Health and Performance Management Solutions Portfolio
- Enabling Memory Choice for Modern AI Systems: Tenstorrent and Rambus Deliver Flexible, Power-Efficient Solutions