100 USB 3.0 IP Design-In... Is PLDA rocketing SuperSpeed USB technology?
Did we (the analyst) completely underestimate SuperSpeed USB take-off, or is the company tweaking the meaning of “USB 3.0 IP Design-In”? This PR from PLDA could be understood as a claiming from the IP vendor that they have achieved the 100th design win for their USB 3.0 IP… Let’s try to understand how PLDA can make more design win than the Total Available Market for SuperSpeed IP.
To read the full article, click here
Related Semiconductor IP
- TSMC 7nm 0V75 / 0V9 ESD Local Clamp – Low Cap
- TSMC 65nm 3V3 ESD Local Clamp – Rad Hard
- TSMC 5nm 1V8, 1.2V and 0.9V ESD Local Protection – Low Cap
- TSMC 3nm 3V3 ESD Local Clamp
- TSMC 3nm 1V2 ESD Local Clamp – Low Capacitance
Related Blogs
- SuperSpeed USB 3.0
- Will Thunderbolt kill SuperSpeed USB?
- SuperSpeed USB finally take off! Synopsys claim over 40 USB 3.0 IP sales...
- IP vendors enable SuperSpeed USB IP take off in 2012
Latest Blogs
- Beyond Trusted: What the NSA’s New Guidance Means for Hardware Security
- A scalable, shader-programmable vector graphics GPU core for low-power MCUs
- Navigating ISO 26262 Part 11: A Guide for Semiconductor Architects
- Embedded Security explained: Digital signatures
- Hardware security verification must go beyond functional testing