What’s on the Horizon for NAND and DRAM?
January is a time where lots of planning and forecast are made, with high hopes usually. Semiconductor memory industry, after several years of prolonged downturn, finally started to see some glimpses of recovery lately. Prices are improving, product migrations happening, new process node migration providing production efficiency and hopefully more profitability to the manufacturers.
Related Semiconductor IP
- Ultra Ethernet MAC & PCS 100G/200G/400G/800G
- Ethernet PCS 100G/200G/400G/800G/1.6T
- Ethernet MAC 100G/200G/400G/800G/1.6T
- Junction Over-Temperature Detector with Linear Centigrade-to-Voltage Output - X-FAB XT018
- Performance P570 Gen 3
Related Blogs
- More signs of spring for the 2010 DRAM market
- DRAM vendors look to 40nm process technology to keep DRAM profits flowing next year
- Cadence support for the Open NAND Flash Interface (ONFI) 3.0 controller and PHY IP solution + PCIe Controller IP opening the door for NVM Express support
- AMD GPUs using new HBM DRAM (and the cost/benefit appears balanced!)
Latest Blogs
- Inside the SiFive Performance™ P570 Gen 3: High Performance Efficiency for Next-Generation Consumer and Commercial Applications
- What the steam engine can teach us about modern chip design
- Automotive silicon in the era of AI, functional safety, and cybersecurity
- JPEG XS Officially Joins GenICam, The Machine Vision Standard Managed By EMVA
- Beyond PCIe Compliance: Why Stress Testing Is Crucial for Edge AI Deployments