DRAM vendors look to 40nm process technology to keep DRAM profits flowing next year
Taiwan Economic News reports that DRAM vendors will be bringing 4x nm process technologies on line during 2010 and 2011 to keep manufacturing profits up. According to P L Pai, vice president of Nanya Technology, DRAM chip makers are presently climbing the learning curve with 40nm process technologies and he says that the lead time of 40nm immersion tools averages nine months.
Related Semiconductor IP
- Mesochronous Bridge for PCIe/CXL
- AI-native GPU
- OpenGMSL Verification IP
- OpenGMSL Leaf IP
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
Related Blogs
- Blogging from Taiwan: TSMC and 40nm Yield
- TSMC 40nm Yield Explained!
- Moore’s Law and 40nm Yield
- Anticipating the (40nm) Deluge
Latest Blogs
- Automated, Faster Specification to Sign-Off with IDS-AI
- NovaTech Automation Crius PIU: Bringing Conventional Instrument Transformers onto the IEC 61850 Process Bus
- Single Pair Ethernet and TSN: The In-Robot Network Behind the Next Humanoid Robots
- A design path to success exists for ultra-low-voltage SoCs
- Where Routine Flow Ends Veriest Formal Expertise Begins