Advanced Fab Capacity Utilisation Tops 90%
August 17, 2009
The indicators just keep on getting better for the semiconductor industry. Fab capacity utilisation is now above 90% for all processes better than 80nm, and for all 300mm wafer processing.
To read the full article, click here
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related Blogs
- Bye Bye Fab-Lite? Infineon Expands Fab Capacity.
- Netbook Chip-Set Orders To Max Out Capacity At TSMC & UMC
- Fab allocation back on the agenda
- Semiconductor Capacity Shortages 2010
Latest Blogs
- AI in Design Verification: Where It Works and Where It Doesn’t
- PCIe 7.0 fundamentals: Baseline ordering rules
- Ensuring reliability in Advanced IC design
- A Closer Look at proteanTecs Health and Performance Management Solutions Portfolio
- Enabling Memory Choice for Modern AI Systems: Tenstorrent and Rambus Deliver Flexible, Power-Efficient Solutions