Advanced Fab Capacity Utilisation Tops 90%
The indicators just keep on getting better for the semiconductor industry. Fab capacity utilisation is now above 90% for all processes better than 80nm, and for all 300mm wafer processing.
To read the full article, click here
Related Semiconductor IP
- DSP-Based 112G SerDes
- XTAL oscillator in TSMC-7nm
- GPU
- V-by-One Verification IP
- AI model compression IP
Related Blogs
- Bye Bye Fab-Lite? Infineon Expands Fab Capacity.
- Netbook Chip-Set Orders To Max Out Capacity At TSMC & UMC
- Fab allocation back on the agenda
- Semiconductor Capacity Shortages 2010
Latest Blogs
- World's First Standards-Compliant 112G PHY IP for Linear Optics: A Turning Point for AI Interconnects
- One Key for Every Door: How Aliro Extends the UWB Digital Key Beyond the Car
- Reprogrammable Post-Quantum Security for SoCs: Why Crypto-Agility Matters
- Designing the Beam Steering Core for a C-Band AESA: A Look at VSI's VBF0644 GaAs Beamformer IC
- Secure Boot for embedded systems: Building a complete chain of trust