Consolidation and EDA innovation
March 20, 2013
According to a poll conducted by EDAC, and presented at the EDAC Consortium’s CEO forecast, 74% of respondents think that consolidation within the EDA industry has been bad for innovation.
Having been in both startups and large EDA companies, I am somewhat surprised by this number and feel that I have to weigh in a little here, because I think the kinds of innovation that happen in both is essential for the health of our industry.
To read the full article, click here
Related Semiconductor IP
- Chiplet Die-to-Die Interconnect IP Solution
- High speed MACsec Engine 100G/200G/400G/800G/1.6T
- Temperature/Voltage sensors
- AMBA Bus Host to eSPI Controller/Target
- AMBA Bus Host to eSPI Controller
Related Blogs
- EDA Industry: Consolidation Remains a Priority
- EDA Consolidation Continues
- Accelerating EDA innovation through SoC design methodology convergence
- EDAC CEOs: consolidation, clouds, and whether Intel will buy Synopsys
Latest Blogs
- Embedded Security explained: Advanced Encryption Standard (AES)
- Cadence Demonstrates PCIe 8.0 PHY at PCI-SIG DevCon 2026
- Cadence Achieves Successful Silicon Validation of 1st IP Test Chips on Intel 18A
- From Classical CAN and CAN FD to CAN XL: Functional Safety and Security for Next-Generation In-Vehicle Communication
- Accelerating Embedded Memory Performance with 16-bit xSPI PSRAM IP