Design Migration isn’t just a sprint – It’s a heptathlon
When migrating analog ICs to a new node, the complexity isn’t in just one task—it’s in all of them. From device analysis and selection to schematic porting, layout transformation to parasitic-aware verification, each step has unique challenges. Among these, adapting the metal stack stands out as a particularly intricate and often underestimated aspect of the migration process.
Why is the Metal Stack such a problem?
The metal stack defines how signals, power, and ground move through the chip. Each process node— offers different metal counts, materials, thicknesses, and fill rules. Even a seemingly small change—like needing to promote a net to a higher layer—can potentially trigger:
- DRC violations
- Via resistance concerns
- Crosstalk and shielding issues
- Violations of metal density and CMP rules
- Rework in layout and full-chip LVS/PEX verifications
For analog designers, who rely on predictable parasitics and symmetry, this can significantly disrupt performance. It’s not copy-paste. It’s weeks of re-engineering.
This is where Thalia’s AMALIA Platform excels
AMALIA doesn’t promise a one-click fix—instead, it blends intelligent automation with domain-specific design expertise.
When modifying the metal stack during IC migration, AMALIA addresses current density and electromigration challenges with a robust, verification-aware workflow that:
- Tracks and enforces design rule constraints and routing configurations to optimize via array placement as part of layout changes.
- Automates design rule corrections with minimal manual intervention, leveraging two AI-assisted algorithms—one for accurate DRC recognition and another for intelligent DRC fixing.
- Ensures electromagnetic conformance after changes to the vias array and connections to the top metal layer.
- Maintains compliance with DRC, LVS, and PEX checks throughout the process.
Our approach respects the analog engineer’s need for control while dramatically reducing effort and risk. Where a manual approach will take many days or several weeks, AMALIA will help you achieve the Metal Stack changes to hours or a few days.
Think of AMALIA as your AI powered IC design migration co-pilot—one that doesn’t get tired, skip checks, or overlook corner cases.
If the IC industry hosted a Design Migration Heptathlon, AMALIA wouldn’t just compete—it would take first in every event.
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related Blogs
- Automatically generated analog IP: How it works in SoC designs
- Showcasing AI-Driven Analog Design Migration at Samsung SAFE Forum
- Process technology analysis: Navigating analog IP migration with precision
- Applied AI in Analog IC Design Migration
Latest Blogs
- AI in Design Verification: Where It Works and Where It Doesn’t
- PCIe 7.0 fundamentals: Baseline ordering rules
- Ensuring reliability in Advanced IC design
- A Closer Look at proteanTecs Health and Performance Management Solutions Portfolio
- Enabling Memory Choice for Modern AI Systems: Tenstorrent and Rambus Deliver Flexible, Power-Efficient Solutions