2010 Semiconductor Foundry Update: Consolidation!
It has been an interesting month in the semiconductor business. Record revenues, profits, aggressive expansion plans, something we have not seen before and may not see again. Let’s start in Taiwan then move to Silicon Valley, Upstate New York, China, and Korea, with a look at: financials, capacity, and consolidation.
Related Semiconductor IP
- TSMC 7nm 0V75 / 0V9 ESD Local Clamp – Low Cap
- TSMC 65nm 3V3 ESD Local Clamp – Rad Hard
- TSMC 5nm 1V8, 1.2V and 0.9V ESD Local Protection – Low Cap
- TSMC 3nm 3V3 ESD Local Clamp
- TSMC 3nm 1V2 ESD Local Clamp – Low Capacitance
Related Blogs
- iSuppli raises 2010 foundry forecast; interesting lessons to learn for India from China’s story!
- Can Intel be a Leading Semiconductor Foundry?
- What Does Semiconductor Industry Consolidation Mean for Embedded Systems Designers?
- EDA Industry: Consolidation Remains a Priority
Latest Blogs
- Beyond Trusted: What the NSA’s New Guidance Means for Hardware Security
- A scalable, shader-programmable vector graphics GPU core for low-power MCUs
- Navigating ISO 26262 Part 11: A Guide for Semiconductor Architects
- Embedded Security explained: Digital signatures
- Hardware security verification must go beyond functional testing