UCIe-S PHY for Standard Package (x32) in TSMC N3P, East/West Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
- TSMC
- 3nm
- N3P
UCIe-S PHY for Standard Package (x32) in TSMC N3P, East/West Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
The multi-channel PHY IP for PCI Express® (PCIe®) 6.x meets today’s demands for higher bandwidth and power efficiency across netw…
PCIe 6.0 PHY, TSMC N6 x4 1.2V, North/South (vertical) poly orientation
The multi-channel PHY IP for PCI Express® (PCIe®) 6.x meets today’s demands for higher bandwidth and power efficiency across netw…
UCIe-S PHY for Standard Package (x16) in SS SF5A, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe-S PHY for Standard Package (x16) in TSMC N3E, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
PCIe 6.0 PHY, TSMC N5 x4, North/South (vertical) poly orientation
The multi-channel PHY IP for PCI Express® (PCIe®) 6.x meets today’s demands for higher bandwidth and power efficiency across netw…
UCIe-S PHY for Standard Package (x32) in TSMC (N3P)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…
UCIe-S PHY for Standard Package (x16) for Automotive in TSMC (N5A)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…
UCIe-A PHY for Advanced Package (x64) in Samsung (SF2)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…
UCIe-A PHY for Advanced Package (x64) in TSMC (N5)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…
UCIe-A PHY for Advanced Package (x64) in Samsung (SF4X)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…
UCIe-A PHY for Advanced Package (x64) in TSMC (N7, N6, N5, N3)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…
UCIe-S PHY for Standard Package (x16) in TSMC (N7, N6, N4P, N5, N3)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…
UCIe-S PHY for Standard Package (x16) in Samsung (SF5A, SF4X, SF2)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…
Controller + ATC + ATS + DTI · RC/EP · x1–x16 · 1 GHz · PCI-SIG certified
Lightweight die-to-die interconnect solution consisting of the Physical Layer, Die-to-Die Layer and Protocol Layer optimized for …
112G LR-Max Ethernet PHY for TSMC N5
Synopsys Multi-Protocol 112G PHY IP is part of Synopsys’ high- performance multi-rate transceiver portfolio for high-end networki…
PCIe 6.0 PHY, SS SF2A x4 1.2V, N/S for Automotive, ASIL B Random, AEC-Q100 Grade 2
The multi-channel Synopsys PHY IP for PCI Express® (PCIe®) 6.0 meets today’s demands for higher bandwidth and power efficiency ac…
PCIe 6.0 PHY G2 , SS SF4X x4, North/South (vertical) poly orientation
The multi-channel Synopsys PHY IP for PCI Express® (PCIe®) 6.0 meets today’s demands for higher bandwidth and power efficiency ac…
PCIe Gen 6 Phy