The Ceva-Waves Links100 is a low-power multi-protocol wireless connectivity IoT platform combining a cost-optimized Wi-Fi 6 1×1 4…
- TSMC
- 22nm
- ULL
- In Production
Semiconductor IP cores (Intellectual Property cores) are reusable design blocks used in SoC and ASIC development to accelerate time-to-market and reduce design complexity.
These IP cores span a broad range of technologies, including Analog & Mixed Signal, Compute Acceleration, Graphics & Vision, Interface Connectivity , Memory Interfaces, Security, Wireless, System Peripheral, Embedded Memories, and Foundation Libraries. The catalog covers everything from analog front-ends, data converters, processors, DSPs, AI accelerators, and imaging solutions to high-speed connectivity, memory controllers and PHYs, cryptographic engines, embedded memory macros, standard cell libraries, and wireless communication IP.
This catalog allows you to explore and compare IP cores from leading vendors, based on performance, power, process node compatibility, and application domain.
Whether you are designing for automotive, wireless communication, consumer electronics, or data centers, you can find the right IP solutions for your system requirements.
The Ceva-Waves Links100 is a low-power multi-protocol wireless connectivity IoT platform combining a cost-optimized Wi-Fi 6 1×1 4…
your custom Switch Fabric, AI, or HPC ASIC with Credo’s SerDes IP.
Highest performance IP for graphics, AI/ML
0.8 to 2.5GHz full wave rectifier with ESD protection
130GF_RECT_01 intended for use in Bluetooth Low Energy applications.
DDR5/4 PHY V2 in TSMC (N7, N6, N5)
The Synopsys DDR5/4 PHY is a physical layer IP interface (PHY) solution for ASIC, ASSP, and system-on-chip (SoC) applications req…
14-bit, 8-GSPS IQ DAC on GF 22FDX
The ODT-DAC-14B8GIQ-GF22FDX is a high performance dual channel current steering 14- bit DAC that operates as an IQ Pair with an u…
12 bit, 500 MSPS ADC on GF 22FDX
The ODT-ADS-12B500M-G22FDX is an ultra-low power ADC designed in a 22nm CMOS process.
Ultra-short reach SerDes with 500 Gbit/s throughput
High-density, low-power SerDes IP delivering 500 Gbit/s throughput for in-package and multi-chip module interconnects, without a silicon interposer.
Unleash the power of precision and innovation with the NS_TX_16G_T16, a 12-bit, 16-Gsps Digital-to-Analog Converter (DAC) array.
Unleash the power of precision and innovation with the NS_RX_12G_T16, a 12-bit, 12-Gsps Analog-to-Digital Converter (ADC).
Home Plug Green PHY MAC Layer TX/RX
ntHPGP_MAC IP core implements “Connectionless CSMA-Only Level-0 CCo“ MAC Layer functionality with Passive Coordination, as detail…
14GHz Integer-N High-Speed PLL
1-VIA’s broad portfolio of general-purpose and optimized LC-PLLs offer a wide range of clocking solutions.
Enables 1.6T and 800G networks
32G NRZ Multi-Protocol PHY
The IP is a 16-bit, delta-sigma (ΣΔ), analog-to-digital converter (ADC).
CT23302 provides means to determine the leakage current of some pre-defined MOS devices in the TSMC 28n technology node.
BandGap V/I Reference Generator
CT20308 is a buffered accurate reference voltage generator, including a low pass filter with an external capacitor for noise redu…
All Digital Fractional-N RF Frequency Synthesizer PLL in TSMC N6/N7
The DeepSub™ pPLL08F is an all digital RF frequency synthesizer PLL featuring industry jitter (sub 300fs), phase noise and compac…
General Purpose All Digital Fractional-N PLL in TSMC N6/N7
The DeepSub™ pPLL02F is a general purpose all digital PLL featuring low-jitter and compact area suitable for many clocking applic…
Ultra-Low-Power Temperature/Voltage Monitor on TSMC 16nm FFC
The ODT-TVM-ULP-001C-16FFCT is an ultralow power temperature and voltage monitor designed in a 16nm standard TSMC process.