Vendor: Ceva, Inc. Category: Bluetooth

Multi-protocol wireless plaform integrating 802.11ax (Wi-Fi 6), Bluetooth 5.4 Dual Mode, 802.15.4 (for Thread, Zigbee and Matter)

The Ceva-Waves Links100 is a low-power multi-protocol wireless connectivity IoT platform combining a cost-optimized Wi-Fi 6 1×1 4…

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TSMC 22nm ULL In Production View all specifications

Overview

The Ceva-Waves Links100 is a low-power multi-protocol wireless connectivity IoT platform combining a cost-optimized Wi-Fi 6 1×1 40 MHz solution, a Bluetooth 5.4 dual-mode solution supporting LE and Classic Audio and numerous profiles, and an 802.15.4 solution for Zigbee, Thread and Matter compliance. These modules are pre-integrated with a single low-power 2.4 GHz radio implemented in TSMC 22 nm and their operation is orchestrated through smart coexistence mechanisms.

Key features

  • Highly versatile multi-protocol wireless connectivity solutions leveraging the latest and market proven Ceva-Waves integrated hardware IP and software platforms, including Wi-Fi, Bluetooth (Classic and LE), 802.15.4 (for Thread, Zigbee and Matter) and UWB
  • Optimized co-existence schemes for each specific configuration
  • Pre-integrated radio solutions, including RF from Ceva and various partners addressing a wide range of configurations and foundry process nodes
  • Easily adaptable to other RF implementations including customer’s own in-house developments
  • Hardware-accelerated embedded security modes and encryption to fully comply with the most demanding wireless-standard specifications
  • Complemented by Ceva’s extensive IP portfolio of Edge AI, audio, voice and sensing solutions

Block Diagram

Ceva-Waves Links100 block diagram

Benefits

  • Turnkey integrated multi-protocol hardware and software platform
  • Faster TTF (Time to Fab) and TTM (Time to Market)
  • Integrated unified testbench
  • Optimized coexistence
  • Pre-adapted for TSMC 22nm ULL RF
  • Product specific customization available to fulfil project requirements

Applications

  • IoT, smart home, industrial, smart watch

What’s Included?

  • Hardware: verilog RTL, testbench, compilation, simulation and synthesis scripts
  • Software: C code packages for each wireless protocol
  • Documents

Silicon Options

Foundry Node Process Maturity
TSMC 22nm ULL In Production

Specifications

Identity

Part Number
Ceva-Waves Links100
Vendor
Ceva, Inc.
Type
Silicon IP

Files

Product Sheet Download

Note: some files may require an NDA depending on provider policy.

Provider

Ceva, Inc.
HQ: USA
Contact Ceva, Inc.

Learn more about Bluetooth IP core

HDT Bluetooth: the Next Step in High Quality Audio Streaming

Wireless audio (wireless earbuds, headphones and speakers) introduced us to a completely new level of listening convenience and freedom, prompting the rapid growth we are already seeing in this consumer segment (30% CAGR for wireless earbuds and 14% for wireless headphones). Now the race is on to further improve audio quality and capability in these devices.

The Rise of Physical AI: When Intelligence Enters the Real World

Artificial Intelligence has largely lived in the digital realm, analyzing text, images, speech, and data streams inside servers, clouds, and devices. A new phase is now emerging: Physical AI. Physical AI extends intelligence beyond perception and reasoning into action, enabling machines to sense, decide, and interact with the physical world in real-time.

Physical AI at the Edge: A New Chapter in Device Intelligence

Ceva’s 2025 Technology Symposium series, held in Shanghai, Hsinchu and Herzliya , brought together a global community of engineers, product leaders, and ecosystem partners. Each location had its own flavor, but a single theme ran through every discussion: how to bring meaningful intelligence to the edge of every device.

UWB, Digital Keys, and the Quest for Greater Range

Ultra-Wideband (UWB) technology is rapidly becoming a household name, and for good reason. This isn’t just another wireless standard, it’s a game-changer for how we interact with the world around us.

Frequently asked questions about Bluetooth IP cores

What is Multi-protocol wireless plaform integrating 802.11ax (Wi-Fi 6), Bluetooth 5.4 Dual Mode, 802.15.4 (for Thread, Zigbee and Matter)?

Multi-protocol wireless plaform integrating 802.11ax (Wi-Fi 6), Bluetooth 5.4 Dual Mode, 802.15.4 (for Thread, Zigbee and Matter) is a Bluetooth IP core from Ceva, Inc. listed on Semi IP Hub. It is listed with support for tsmc In Production.

How should engineers evaluate this Bluetooth?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Bluetooth IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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