Vendor: Ceva, Inc. Category: Bluetooth

Multi-protocol wireless plaform integrating 802.11ax (Wi-Fi 6), Bluetooth 5.4 Dual Mode, 802.15.4 (for Thread, Zigbee and Matter)

The Ceva-Waves Links100 is a low-power multi-protocol wireless connectivity IoT platform combining a cost-optimized Wi-Fi 6 1×1 4…

TSMC 22nm ULL In Production View all specifications

Overview

The Ceva-Waves Links100 is a low-power multi-protocol wireless connectivity IoT platform combining a cost-optimized Wi-Fi 6 1×1 40 MHz solution, a Bluetooth 5.4 dual-mode solution supporting LE and Classic Audio and numerous profiles, and an 802.15.4 solution for Zigbee, Thread and Matter compliance. These modules are pre-integrated with a single low-power 2.4 GHz radio implemented in TSMC 22 nm and their operation is orchestrated through smart coexistence mechanisms.

Key features

  • Highly versatile multi-protocol wireless connectivity solutions leveraging the latest and market proven Ceva-Waves integrated hardware IP and software platforms, including Wi-Fi, Bluetooth (Classic and LE), 802.15.4 (for Thread, Zigbee and Matter) and UWB
  • Optimized co-existence schemes for each specific configuration
  • Pre-integrated radio solutions, including RF from Ceva and various partners addressing a wide range of configurations and foundry process nodes
  • Easily adaptable to other RF implementations including customer’s own in-house developments
  • Hardware-accelerated embedded security modes and encryption to fully comply with the most demanding wireless-standard specifications
  • Complemented by Ceva’s extensive IP portfolio of Edge AI, audio, voice and sensing solutions

Block Diagram

Ceva-Waves Links100 block diagram

Benefits

  • Turnkey integrated multi-protocol hardware and software platform
  • Faster TTF (Time to Fab) and TTM (Time to Market)
  • Integrated unified testbench
  • Optimized coexistence
  • Pre-adapted for TSMC 22nm ULL RF
  • Product specific customization available to fulfil project requirements

Applications

  • IoT, smart home, industrial, smart watch

What’s Included?

  • Hardware: verilog RTL, testbench, compilation, simulation and synthesis scripts
  • Software: C code packages for each wireless protocol
  • Documents

Silicon Options

Foundry Node Process Maturity
TSMC 22nm ULL In Production

Specifications

Identity

Part Number
Ceva-Waves Links100
Vendor
Ceva, Inc.
Type
Silicon IP

Files

Product Sheet Download

Note: some files may require an NDA depending on provider policy.

Provider

Ceva, Inc.
HQ: USA

Learn more about Bluetooth IP core

The FCC Is Modernizing UWB Rules. Why It Matters for the Next Wave of Innovation

Ceva’s next-generation Ceva-Waves UWB architecture supports the new standard, delivering advanced ranging performance in challenging Non-Line-of-Sight (NLoS) environments and at extended range, while maintaining low-power operation and resilience to interference. It also supports UWB radar sensing and new channels introduced with the latest generation of the standard.

Frequently asked questions about Bluetooth IP cores

What is Multi-protocol wireless plaform integrating 802.11ax (Wi-Fi 6), Bluetooth 5.4 Dual Mode, 802.15.4 (for Thread, Zigbee and Matter)?

Multi-protocol wireless plaform integrating 802.11ax (Wi-Fi 6), Bluetooth 5.4 Dual Mode, 802.15.4 (for Thread, Zigbee and Matter) is a Bluetooth IP core from Ceva, Inc. listed on Semi IP Hub. It is listed with support for tsmc In Production.

How should engineers evaluate this Bluetooth?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Bluetooth IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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