Synopsys is a leading provider of high-quality, silicon-proven semiconductor IP solutions for SoC designs. The broad Synopsys IP portfolio includes logic libraries, embedded memories, analog IP, wired and wireless interface IP, security IP, embedded processors and subsystems. To accelerate IP integration, software development, and silicon bring-up, Synopsys’ IP Accelerated initiative provides architecture design expertise, pre-verified and customizable IP subsystems, hardening, and signal/power integrity analysis. Synopsys' extensive investment in IP quality, comprehensive technical support and robust IP development methodology enables designers to reduce integration risk and accelerate time-to-market.
DisplayPort 1.4 TX PHY, TSMC N5, North/South Poly Orientation
The USB-C 3.1/DisplayPort 1.4 IP solution consists of USB-C 3.1/DisplayPort 1.4 PHYs, USB-C 3.1/DisplayPort 1.4 controllers (Devi…
The High-Bandwidth Interconnect PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for…
Die-to-Die, AIB 2.0 PHY Ported to Intel 16, North/South (vertical) poly orientation
The High-Bandwidth Interconnect PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for…
The XSR PHY IP for 112Gbps per lane die-to-die connectivity enables high-bandwidth ultra and extra short reach interfaces in mult…
D2D Controller addon for D2D SR112G PHY with CXS interface
The Die-to-Die Controller IP, optimized for latency, bandwidth, power, and area, enables efficient inter-die connectivity in serv…
UCIe-S PHY for Standard Package (x16) in TSMC N5, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe-A PHY for Advanced Package (x64) in TSMC N5, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe-S PHY for Standard Package (x16) in SS SF4X, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe-A (Gen2) PHY for Advanced Package (x64) in SS SF4X, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe-S PHY for Standard Package (x16) in SS SF2, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe-A PHY for Advanced Package (x64) in SS SF2, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
graphics, high-performance computing (HPC) and networking applications are requiring more memory bandwidth to keep pace with the …
The HBM3 PHY is a physical layer IP interface (PHY) solution for high-performance computing (HPC), AI, graphics, and networking A…
The HBM3 PHY is a physical layer IP interface (PHY) solution for high-performance computing (HPC), AI, graphics, and networking A…
HBM3 Solution enabling access to HBM3 Controller in TSMC N5 1.2V
The HBM3 Controller IP is optimized for power, latency, bandwidth, and area, supporting the JEDEC HBM3 standard.
HBM3 Solution enabling access to HBM3 Controller and HBM3 PHY in TSMC N5 1.2V
The HBM3 Controller IP is optimized for power, latency, bandwidth, and area, supporting the JEDEC HBM3 standard.
The DDR multiPHY IP solutions are mixed-signal PHY IP cores that supply the physical interface to JEDEC standard DDR3, DDR3L (1.3…
The Gen 2 DDR multiPHY IP cores are mixed-signal PHY IP cores that supply the physical interface to JEDEC standard LPDDR2, LPDDR3…