FDSOI
FDSOI (Fully Depleted Silicon-On-Insulator) is a semiconductor fabrication technology where a thin silicon layer is placed on top of an insulating layer (buried oxide). This structure allows the transistor channel to be fully depleted, enabling better control over short-channel effects, lower leakage current, and higher switching speed compared to conventional bulk CMOS.
Key characteristics of FDSOI:
- Thin silicon layer fully depletes carriers
- Buried oxide isolates the active silicon layer from the substrate
- Enables body-biasing techniques to dynamically adjust transistor performance
Related Articles
- FD-SOI: A Cyber-Resilient Substrate Against Laser Fault Injection—The Future Platform for Secure Automotive Electronics
- It's Time to Look at FD-SOI (Again)
- Electronic Circuit Design for RF Energy Harvesting using 28nm FD-SOI Technology
- A 0.32 mm² 100 Mb/s 223 mW ASIC in 22FDX for Joint Jammer Mitigation, Channel Estimation, and SIMO Data Detection
- Optimizing Energy Efficiency in Subthreshold RISC-V Cores
Related Blogs
- FDSOI Status and Roadmap
- FD-SOI vs FinFET: Dan Hutcheson Re-Runs His Survey
- FD-SOI State of the Union: There's Supply - Is There Demand?
- Silicon on Nothing: the Origins of FD-SOI
- GloFo's 12nm FD-SOI: why it makes headlines in China
Related News
- Quobly marks a new milestone towards industrialization with Soitec’s 28Si FD-SOI substrates now cycling in ST’s 300mm fab
- Soitec and CEA partner to develop automotive cybersecurity with advanced FD-SOI technology
- VeriSilicon Introduces FD-SOI Wireless IP Platform for Diverse IoT and Consumer Electronics Applications
- CEA-Leti and Soitec Announce Strategic Partnership to Leverage FD-SOI for Enhanced Security of Integrated Circuits
- FAMES makes its open call for 10nm, 7nm FD-SOI
The Pulse
- Hardware Root of Trust Essential for AI Chip Integrity
- AI Compute Demand Drives 44% YoY Growth for Top 10 Global Fabless IC Firms in 2025
- VolTune: A Fine-Grained Runtime Voltage Control Architecture for FPGA Systems
- IBM Announces Strategic Collaboration with Arm to Shape the Future of Enterprise Computing
- What is the EDA problem worth solving with AI?
- Rambus Unveils HBM4E Controller: 16 GT/s, 2,048-Bit Interface, Enabling C-HBM4E
- AimFuture, a Leader in Home Appliance NPUs, to Integrate Mesacure Company’s AI Algorithms
- Security in the Quantum Era: From Cryptography to Trust — ICTK Introduces a Hardware Trust Foundation for the Quantum Era
- TES unveils a next-generation Elliptic Curve Digital Signature Algorithm (ECDSA) IP Core for Secure IoT, Blockchain, and Industrial Systems
- Synopsys Advances Die‑to‑Die Connectivity with 64G UCIe IP Tape‑Out
- Seligman Ventures Leads Cognichip’s $60M Series A to Back Physics-Informed AI for Chip Design, Intel CEO Lip-Bu Tan and Seligman Ventures’ Umesh Padval Join the Board
- SEMI Projects Double-Digit Growth in Global 300mm Fab Equipment Spending for 2026 and 2027
- Intel to Repurchase 49% Equity Interest in Ireland Fab Joint Venture
- The 5 Biggest Challenges in Modern SoC Design (And How to Solve Them)
- AGI CPU: Arm’s $100B AI Silicon Tightrope Walk Without Undermining Its Licensees